10AX090S2F45E2LG vs 10AX090R2F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX090S2F45E2LG von Intel und 10AX090R2F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090S2F45E2LG | 10AX090R2F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.750,00 | $4.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900000 |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | Variable-precision, 24-bit multiplier base | Variable-precision, hardened floating-point capable |
| Adaptive Logic Modules (ALMs) | 338,200 | — |
| Transceiver Channels | Up to 24 (data rate per channel up to 14.1 Gbps) | — |
| Hard Memory Controllers | 4, supports DDR4 / DDR3 / RLDRAM3 / QDR IV | — |
| PCIe Hard IP | PCI Express Gen3 x8 / Gen2 x8 | — |
| Process Technology | 20 nm Tri-Gate (FinFET) | — |
| Speed Grade | E2 (commercial/extended) | 2 (R2 -2 transceiver rating) |
| Gehäuse | 1932-ball FCBGA, 45 mm body (F45) | — |
| Operating Temperature Grade | Industrial (per -LG suffix convention; verify against order code) | — |
| Core Voltage (Vcc) | 0.9 V (nominal; per family datasheet) | — |
| User I/O Banks | [DATA_NEEDED: total user I/O count for 10AX090S2F45E2LG] | — |
| RoHS / Lead-Free | Yes (LG suffix indicates Pb-free) | — |
| Configuration Interface | Active serial (EPCQ-L), JTAG, Fast Passive Parallel | — |
| LABs/CLBs | — | 339620 |
| Total RAM Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Code | — | F40 (approx. 40mm FCBGA) |
| Temperature Grade | — | E2 (Extended: -40C to +100C junction) |
| Lead-Free / RoHS | — | Yes (SG suffix) |
| Transceivers | — | Up to 14.1 Gbps (Arria 10 GX feature) |
| Process Node | — | TSMC 20nm |
| Montageart | — | Surface Mount (FCBGA ball grid) |
| MSL-Level | — | 3 (168 Hours) |
| Packaging | — | Tray |