10AX090S2F45E2LG vs 10AX090R2F40E2SG Comparação
Comparação detalhada lado a lado de 10AX090S2F45E2LG por Intel e 10AX090R2F40E2SG por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10AX090S2F45E2LG | 10AX090R2F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3.750,00 | $4.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900000 |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | Variable-precision, 24-bit multiplier base | Variable-precision, hardened floating-point capable |
| Adaptive Logic Modules (ALMs) | 338,200 | — |
| Transceiver Channels | Up to 24 (data rate per channel up to 14.1 Gbps) | — |
| Hard Memory Controllers | 4, supports DDR4 / DDR3 / RLDRAM3 / QDR IV | — |
| PCIe Hard IP | PCI Express Gen3 x8 / Gen2 x8 | — |
| Process Technology | 20 nm Tri-Gate (FinFET) | — |
| Speed Grade | E2 (commercial/extended) | 2 (R2 -2 transceiver rating) |
| Encapsulamento | 1932-ball FCBGA, 45 mm body (F45) | — |
| Operating Temperature Grade | Industrial (per -LG suffix convention; verify against order code) | — |
| Core Voltage (Vcc) | 0.9 V (nominal; per family datasheet) | — |
| User I/O Banks | [DATA_NEEDED: total user I/O count for 10AX090S2F45E2LG] | — |
| RoHS / Lead-Free | Yes (LG suffix indicates Pb-free) | — |
| Configuration Interface | Active serial (EPCQ-L), JTAG, Fast Passive Parallel | — |
| LABs/CLBs | — | 339620 |
| Total RAM Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Code | — | F40 (approx. 40mm FCBGA) |
| Temperature Grade | — | E2 (Extended: -40C to +100C junction) |
| Lead-Free / RoHS | — | Yes (SG suffix) |
| Transceivers | — | Up to 14.1 Gbps (Arria 10 GX feature) |
| Process Node | — | TSMC 20nm |
| Tipo de montagem | — | Surface Mount (FCBGA ball grid) |
| Nível MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |