10AX115H2F34E2SG vs 10AX115H2F34E1SG Vergleich
Detaillierter Direktvergleich von 10AX115H2F34E2SG von Intel und 10AX115H2F34E1SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115H2F34E2SG | 10AX115H2F34E1SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.500,00 | $3.300,00 |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | Up to 24 channels, 17.4 Gbps (per Arria 10 GX family) |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCIe Gen3 x8 (per family datasheet) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | — |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Gehäuse | 1152-ball FCBGA (F34) 35x35 mm | 1152-BBGA, FCBGA (F34) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Family | — | Intel Arria 10 |
| Logic Elements (LEs) | — | 1,150,000 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Embedded Memory (Bits) | — | 68,857,856 |
| Number of I/O | — | 504 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 20 nm |
| Betriebstemperatur | — | -40C to +100C (E1 grade, industrial) |
| Configuration Type | — | SRAM-based, requires external boot flash |