10AX115H2F34E2SG - Arria 10 GX FPGA 1150K LE 504 I/O | Intel
Teilenummer: 10AX115H2F34E2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6344.57 | $6.344,57 |
| 10 | $6170 | $61.700,00 |
| 50 | $5980 | $299.000,00 |
| 100 | $5760 | $576.000,00 |
| 500 | $5500 | $2.750.000,00 |
10AX115H2F34E2SG Übersicht
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing programmable logic blocks, routing fabric, and dedicated hardware resources such as DSP slices, transceivers, and block memory. Modern FPGAs sit within the broader semiconductor hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The Arria 10 family is engineered for mid-range applications that require transceivers, DSP, and ARM hard processor system integration, balancing Stratix-class performance against Cyclone-class power efficiency.
Key features include 24 high-speed transceivers up to 14.1 Gbps, embedded Multi-Gigabit Transceivers (EMGCs), hardened IEEE 754 single/double-precision floating-point DSP blocks, 2,150 18x19 multipliers, up to 24 fractional PLLs, and partial reconfiguration support. The device supports DDR4 external memory interfaces up to 1,600 Mbps and includes a Hard Processor System (HPS) with dual-core ARM Cortex-A9 MPCore. These resources enable efficient implementation of high-throughput data pipelines and protocol bridges.
Typical applications include 100G/400G optical transport networking, wireless LTE/5G baseband processing, military radar and electronic-warfare DSP, broadcast video processing, and PCI Express Gen3 endpoint/root-port designs. The combination of transceivers, DSP blocks, and HPS makes the Arria 10 GX well-suited for heterogeneous compute and protocol aggregation platforms.
When designing with the 10AX115H2F34E2SG, ensure the PCB land pattern matches the 1152-ball FCBGA footprint and that thermal vias under the package provide adequate heat extraction. The -E2 industrial grade requires derating for transceivers above 100 C junction. Quartus Prime provides the reference design flow, IP library, and pinout files.
Drop-in-Alternativen für 10AX115H2F34E2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115H2F34E2SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Embedded Memory, Operating Temperature, PCIe Hard IP.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115H2F34E1SG
✅ Drop-In✓ Auf Lager
$3300 / Stück
Datenblatt ansehen →10AX115H2F34E2LG
✅ Drop-In✓ Auf Lager
$5950 / Stück
Datenblatt ansehen →10AX115H2F34E2HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AX115H2F34I1SG
✅ Drop-In✓ Auf Lager
$3700 / Stück
Datenblatt ansehen →10AX115H1F34E1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2895 / Stück
Datenblatt ansehen →10AX115H2F34E2SG Grenzwerte & elektrische Eigenschaften
| Series | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits |
| User I/O Pins | 504 |
| Transceivers | 24 channels up to 14.1 Gbps |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point |
| 18x19 Multipliers | 2,150 |
| PLLs | Fractional, up to 24 |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 |
| Gehäuse | 1152-ball FCBGA (F34) 35x35 mm |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) |
| Process Node | 20 nm Tri-Gate (Intel) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
10AX115H2F34E2SG 1152-ball fcbga (f34) 35x35 mm Pinbelegungsleitfaden
Pinbelegung für 10AX115H2F34E2SG (1152-ball fcbga (f34) 35x35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115H2F34E2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115H2F34E2SG ist geeignet für 6 Anwendungs: 100G Optical Transport Networking, Wireless Baseband and Radio Processing, Military Radar and EW Signal Processing, PCIe Gen3 Accelerator Cards, Broadcast Video Processing, Industrial Motor Control and Drives.
100G Optical Transport Networking
The 10AX115H2F34E2SG's 24 transceivers at 14.1 Gbps aggregate to a 100G-class fabric when combined with MAC/PCS IP, making it ideal for OTU4/100GbE line cards. Its 1.15M logic elements comfortably fit OTN framer/mapper, GFP, and FEC engines (Reed-Solomon RS(255,239)) with margin. The hardened ARM Cortex-A9 HPS supports control-plane management via NetConf/YANG. Design tip: dedicate 4 transceivers per OTU4 port with 1588v2 timestamping for telecom-grade synchronization.
Empfohlen
Wireless Baseband and Radio Processing
Arria 10 GX FPGA architecture is purpose-built for LTE/5G baseband with hardened floating-point DSP blocks performing matrix inversion, FFT/iFFT, and turbo decoding in real time. The 2,150 18x19 multipliers and IEEE 754 single/double-precision DSP slices execute channel estimation and MIMO detection at line rate. Combined with CPRI/OBSAI framer IP, the device collapses BBU and RRH processing onto one chip. Designers should leverage partial reconfiguration to switch between LTE and 5G NR waveforms dynamically.
Empfohlen
Military Radar and EW Signal Processing
The 10AX115H2F34E2SG's combination of 24 transceivers (digitizing radar antenna arrays), 68.86 Mbit block memory (FFT window buffers), and 2,150 multipliers (pulse-Doppler processing) provides the compute density required for active electronically scanned array (AESA) radars. The E2 industrial temperature grade supports ground-mobile and naval deployments. FPGA fabric integrates SAR image formation, electronic counter-countermeasures (ECCM), and adaptive beamforming with deterministic latency that DSP processors cannot match.
Empfohlen
PCIe Gen3 Accelerator Cards
The 10AX115H2F34E2SG includes a hard PCIe Gen3 x4 (and Gen2 x8) controller, enabling drop-in endpoint functionality for x86 host attachments at 32 Gbps aggregate. Designers implement DMA engines, MSI-X interrupt handlers, and PIO registers directly in FPGA logic, accelerating analytics, NVMe controllers, or network interface functions. The hardened IP frees programmable fabric for application-specific acceleration such as compression, encryption, or AI inference.
Empfohlen
Broadcast Video Processing
Broadcast video infrastructure demands uncompressed 12G-SDI/Quad-Link 3G-SDI routing, frame-rate conversion, and HDR/wide-color-gamut mapping. The 10AX115H2F34E2SG processes 4K/UHD signals at 60 fps with up/down/cross-conversion while running audio embedding, Dolby metadata insertion, and genlock logic. Arria 10 GX video IP (HDMI 2.0, DisplayPort 1.4, SDI) provides the necessary PHY and protocol stack. Designers should allocate sufficient M20K memory for triple-buffered frame buffers at 4K resolution.
Empfohlen
Industrial Motor Control and Drives
Industrial servo drives and AC variable-frequency drives benefit from FPGA-based field-oriented control (FOC) loops executing at microsecond latency, far below processor-based implementations. The 10AX115H2F34E2SG runs multi-axis FOC with sine/cosine encoder decoding, space-vector PWM generation, and EtherCAT slave stack concurrently. The hardened ARM Cortex-A9 HPS hosts Linux for system management while the FPGA fabric executes the deterministic real-time control loops. Industrial-grade E2 temperature (-40 C storage, 0-100 C junction) supports factory floor deployment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115H2F34E2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115H2F34E1SG | 10AX115H2F34E2LG | 10AX115H2F34E2HG | 10AX115H2F34I1SG | 10AX115H1F34E1SG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Transceiver Speed Grade | -2 (up to 14.1 Gbps) | -1 (up to 12.5 Gbps) | -2 (up to 14.1 Gbps) | -2 (up to 14.1 Gbps) | -1 (up to 12.5 Gbps) | -1 (lower tier) |
| User I/O | 504 | 504 | 504 | 504 | 504 | 504 |
| Temperature Grade | E2 industrial (0-100 C) | E2 industrial (0-100 C) | E2 industrial (0-100 C) | E2 extended | I1 industrial (-40-100 C) | E1 industrial |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Embedded Memory (bits) | 68,857,600 | 68,857,600 | 68,857,600 | 68,857,600 | 68,857,600 | 68,857,600 |
Wichtigste Unterscheidungsmerkmale
- Same-family drop-in alternative offering lower cost for 12.5 Gbps designs (vs. 10AX115H2F34E1SG)
- Lead-free RoHS-compliant variant for regulated markets (vs. 10AX115H2F34E2LG)
- Wider industrial temperature grade option (vs. 10AX115H2F34I1SG)
Designhinweise
The 1152-ball FCBGA F34 package requires a high-density PCB land pattern with staggered micro-via arrays (typically 0.4-0.5 mm pitch). Use a 1.6 mm minimum PCB thickness with stacked-via-in-pad structures for BGA breakout. Per Intel's package specifications, the 35x35 mm body requires at least 4 signal layers between BGA and BGA-fanout area. Implement a continuous ground plane on layers 2 and N-1 to control return paths for the 14.1 Gbps transceivers.
The 10AX115H2F34E2SG can dissipate 18-25 W under full transceiver + DSP utilization at 100 C junction. Mandatory thermal management includes a thermal interface material (TIM) between the package top and a heatsink, plus thermal vias beneath the central BGA ground balls to the inner plane. Without heatsinking, the device will thermal-throttle and the E2 industrial temperature rating will be violated. Estimate: junction-to-ambient theta_JA on a JEDEC 4-layer test board is approximately 8-10 C/W with proper thermal via array.
Transceiver channels require matched-length routing with controlled impedance (100 ohm differential for backplane rates). Maintain within-pair skew below 1 ps/mm and pair-to-pair skew below 5 ps for 14.1 Gbps. AC-coupling capacitors must be 0402 size or larger with C0G/NP0 dielectric to minimize parasitic inductance. Reference Intel AN 615 ('Design and Layout Guidelines for Arria 10 GT/GX Transceivers') for channel compliance.
Do not confuse the F34 package (1152-ball, 504 I/O) with F40 (1517-ball, 600 I/O). Pin assignments differ entirely. The 'H2' suffix indicates high-density 1.15M-LE device with all transceiver channels; 'N' denotes GT-family parts. Configuration mode pins (MSEL) must be set correctly per Quartus Prime programmer for the chosen JTAG/AS/PS/FPP mode, otherwise the device will fail to configure.
Compliance-Informationen
RoHS compliant per Intel product page. AEC-Q100 not applicable for FPGAs. Lead-free verified; halogen-free status not explicitly listed in retrieved distributor data - verify with Intel product compliance report.
