10AX115H2F34E2SG vs 10AX115H3F34E2LG Vergleich
Detaillierter Direktvergleich von 10AX115H2F34E2SG von Intel und 10AX115H3F34E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115H2F34E2SG | 10AX115H3F34E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.500,00 | $6.550,00 |
| Series | Arria 10 GX | 10AX115 |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | Up to 17.4 Gbps (per Arria 10 datasheet) |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Variable-precision DSP (per Arria 10 datasheet) |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Gehäuse | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (F34), 1.0 mm pitch |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA, reflow) |
| RoHS-Status | Compliant | Compliant |
| Family | — | Arria 10 GX |
| Embedded Memory | — | 68,857,856 bits (67.7 Mbit) |
| User I/O Count | — | 504 |
| Hard IP | — | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller |
| Process Technology | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | E2 (commercial, mid-speed) |
| Betriebstemperatur | — | 0C to +100C (commercial) |
| MSL-Level | — | MSL3 (per JEDEC J-STD-020) |