10AX115H3F34I2LG vs 10AX115H1F34E1SG Vergleich

Detaillierter Direktvergleich von 10AX115H3F34I2LG von Intel und 10AX115H1F34E1SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10AX115H3F34I2LG 10AX115H1F34E1SG
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $6.800,00 $2.895,00
Family Arria 10 GX Arria 10 GX
Logic Elements (LEs) 1,150,000 —
Embedded Memory 68,857,856 bits 68,857,856 bits (68.86 Mbits)
User I/O Count 504 —
Transceiver Count 24 Up to 24 channels (96 with PMA-only mode, device-family level)
Maximum Transceiver Data Rate 17.4 Gbps —
DSP Blocks Variable-precision, floating-point capable Variable-precision DSP, ~1,518 to ~1,500 (family-level)
DSP Performance Up to 1.5 TFLOP/s (FP) —
Hardened Memory Controllers DDR4/DDR3/LPDDR3 —
Hardened PCIe PCIe Gen3 x8 —
Hardened Ethernet MAC 10G/40G/100G capable —
Core Voltage 0.9 V 0.9 V
Process Node 20 nm —
Gehäuse 1152-ball FCBGA 1152-ball FCBGA (F34)
Speed Grade H3 —
Temperature Grade Industrial (-40C to +100C junction) —
RoHS-Status Compliant —
Logic Elements — 1,150,000
User I/Os — 504
Process Technology — 20 nm
Transceiver Speed Grade — Up to 17 Gbps (speed grade 1); 24 Gbps supported at higher speed grades
PCIe Hard IP — PCIe Gen3 x8 (hardened)
PLLs — Fractional and integer PLLs (family-level)
Hard Memory Controllers — Yes (DDR3/DDR4/LPDDR3 support)
Betriebstemperatur — Extended (E1) industrial grade
RoHS Compliance — Yes (lead-free SG suffix)
Montageart — Surface Mount, Flip-Chip BGA

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern