10AX115H1F34E1SG - Arria 10 GX 1.15M LEs FPGA | Intel | 1152-FCBGA
Teilenummer: 10AX115H1F34E1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3850 | $3.850,00 |
| 10 | $3650 | $36.500,00 |
| 100 | $3380 | $338.000,00 |
| 500 | $3120 | $1.560.000,00 |
| 1.000 | $2895 | $2.895.000,00 |
10AX115H1F34E1SG Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers can configure post-manufacturing to implement custom digital logic functions, parallel processing pipelines, and high-speed serial interfaces. FPGAs sit hierarchically below ASICs in design flexibility and above microcontrollers in raw logic density. The Arria 10 family is a mid-range, transceiver-rich family positioned between the lower-cost Cyclone series and the high-performance Stratix series, making it well-suited for applications requiring 10-25 Gbps serial links, DSP-intensive signal processing, and PCIe Gen3 system integration.
Key features of the 10AX115H1F34E1SG include 1,150,000 logic elements, 68.86 Mbits embedded memory, integrated transceivers supporting up to 17 Gbps (speed grade 1) with 24 Gbps capability in higher speed grades, hardened PCIe Gen3 x8 IP blocks, and 504 user I/Os distributed across 12 I/O banks. The device also integrates variable-precision DSP blocks, hard memory controllers, and an SoC subsystem option in related Arria 10 SX variants. The F34 package (1152-ball FCBGA) provides high signal density and supports high-performance signaling for memory and serial interfaces.
Typical applications include high-speed data acquisition, test and measurement equipment, medical imaging systems, military/aerospace signal processing, broadcast video processing, 10/25/40/100G Ethernet aggregation, and PCIe Gen3-based accelerators. The high logic count and transceiver bandwidth make this device especially appropriate for multi-channel waveform generation, radar processing, and high-speed protocol bridging.
Designers should pay close attention to the F34 PCB footprint, transceiver reference clocking topology, and decoupling strategy. Power estimation using Intel's Early Power Estimator (EPE) is strongly recommended before PCB commitment, as a fully populated 10AX115 device can exceed 25W under typical workloads. Thermal management requires a 6-8 layer PCB with internal copper planes for heat spreading.
Drop-in-Alternativen für 10AX115H1F34E1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115H1F34E1SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, PCIe Hard IP, Family, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115H2F34E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5500 / Stück
Datenblatt ansehen →10AX115H1F34I1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6500 / Stück
Datenblatt ansehen →10AX115H3F34E3SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AX115N1F34E1SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AX115H1F34E1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbits) |
| User I/Os | 504 |
| Gehäuse | 1152-ball FCBGA (F34) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Transceiver Speed Grade | Up to 17 Gbps (speed grade 1); 24 Gbps supported at higher speed grades |
| Transceiver Count | Up to 24 channels (96 with PMA-only mode, device-family level) |
| PCIe Hard IP | PCIe Gen3 x8 (hardened) |
| DSP Blocks | Variable-precision DSP, ~1,518 to ~1,500 (family-level) |
| PLLs | Fractional and integer PLLs (family-level) |
| Hard Memory Controllers | Yes (DDR3/DDR4/LPDDR3 support) |
| Betriebstemperatur | Extended (E1) industrial grade |
| RoHS Compliance | Yes (lead-free SG suffix) |
| Montageart | Surface Mount, Flip-Chip BGA |
10AX115H1F34E1SG 1152-ball fcbga (f34) Pinbelegungsleitfaden
Pinbelegung für 10AX115H1F34E1SG (1152-ball fcbga (f34)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115H1F34E1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115H1F34E1SG ist geeignet für 8 Anwendungs: 100G Ethernet Aggregation Switch, Radar and Electronic Warfare Signal Processing, Medical Imaging Systems, Test and Measurement Equipment, Broadcast Video Processing, High-Speed Data Acquisition Systems, Aerospace and Defense Signal Processing, PCIe Gen3 Accelerator Card.
100G Ethernet Aggregation Switch
The 10AX115H1F34E1SG's 1,150,000 LEs and 17 Gbps transceivers make it suitable for 100G Ethernet aggregation switching line cards. Multiple 10/25G Ethernet ports can be aggregated through the device's transceiver channels, while the 68.86 Mbits of embedded memory supports packet buffering at line rate. Hardened PCIe Gen3 x8 IP blocks enable direct connection to a switch ASIC or CPU, reducing latency. The F34 1152-ball FCBGA package provides the high pin density required for multi-port SERDES deployments.
Empfohlen
Radar and Electronic Warfare Signal Processing
The 10AX115H1F34E1SG is well matched to radar and electronic warfare systems requiring high DSP throughput. The device's variable-precision DSP blocks support high-sample-rate FFTs, beamforming, and pulse compression algorithms. The 17 Gbps transceivers enable direct ADC/DAC interface via JESD204B/C, while 504 user I/Os support parallel data capture and timing. Intel's radiation-tolerant Arria 10 variants extend usability to space-grade deployments.
Empfohlen
Medical Imaging Systems
The 10AX115H1F34E1SG supports medical imaging modalities including ultrasound, CT, and MRI front-end processing. The 1,150,000 LEs enable real-time beamforming in ultrasound systems, while 17 Gbps transceivers connect to high-speed ADCs over JESD204B. The extended temperature grade (E1) and low power-per-LE make the device appropriate for cart-based and portable imaging equipment. PCIe Gen3 x8 hard IP provides direct CPU/GPU interface for downstream image reconstruction.
Empfohlen
Test and Measurement Equipment
The 10AX115H1F34E1SG is used in high-end test and measurement equipment such as protocol analyzers, high-speed pattern generators, and arbitrary waveform generators. The 504 user I/Os support parallel test bus implementation, while 17 Gbps transceivers handle multi-lane protocol testing (PCIe, USB 3.1, SATA). The 68.86 Mbits of embedded memory stores large pattern sequences and capture buffers, and the device's high Fmax in speed grade 1 enables tight timing margins in measurement applications.
Empfohlen
Broadcast Video Processing
The 10AX115H1F34E1SG powers broadcast video processing systems including 4K/8K video routers, format converters, and contribution encoders. The 1,150,000 LEs handle multi-channel HEVC/H.265 encoding and decoding, while 17 Gbps transceivers support 12G-SDI and SMPTE ST 2022-7 hitless switching. The 504 user I/Os accommodate large video crosspoint matrices, and PCIe Gen3 x8 hard IP enables direct connection to host media servers.
Empfohlen
High-Speed Data Acquisition Systems
The 10AX115H1F34E1SG is used in multi-channel high-speed data acquisition systems for scientific instruments, sonar arrays, and high-energy physics experiments. The 17 Gbps transceivers support multi-lane JESD204B/C ADC interfacing, while 1,150,000 LEs handle real-time correlation, FFT, and digital down-conversion. The 68.86 Mbits of embedded memory provides per-channel sample buffering, and the F34 1152-ball FCBGA package supports up to 504 user I/Os for timing, triggering, and control signals.
Empfohlen
Aerospace and Defense Signal Processing
The 10AX115H1F34E1SG is well suited to aerospace and defense applications including software-defined radio, electronic countermeasures, and secure communications. The 1,150,000 LEs support multi-channel wideband signal processing, while 17 Gbps transceivers enable high-throughput data links. Intel's Arria 10 family offers extended temperature and military temperature grades (E1/I1) for harsh environments. The device's high logic density makes it appropriate for single-board implementations of multi-function RF systems.
Empfohlen
PCIe Gen3 Accelerator Card
The 10AX115H1F34E1SG serves as a co-processor in PCIe Gen3 accelerator cards for high-performance computing and machine learning inference. The hardened PCIe Gen3 x8 IP block provides direct host interface with low latency, while 1,150,000 LEs handle custom accelerator pipelines. The 17 Gbps transceivers support high-bandwidth memory expansion and external interconnect, and the 504 user I/Os are useful for mezzanine I/O and expansion headers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115H1F34E1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115H2F34E2SG | 10AX115H1F34I1SG | 10AX115H3F34E3SG | 10AX115N1F34E1SG | 10AX090R2F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1517-ball FCBGA (F40) - different, requires PCB rework |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| User I/Os | 504 | 504 | 504 | 504 | 384 | 380 |
| Max Transceiver Data Rate | 17 Gbps (grade 1) | 24 Gbps | 17 Gbps | 17 Gbps | N/A (no transceivers) | 10.3125 Gbps |
| Speed Grade | E1 (extended grade 1) | E2 (extended grade 2) | I1 (industrial grade 1) | E3 (extended grade 3) | E1 (extended grade 1) | E1 (extended grade 1) |
| Embedded Memory | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 53.2 Mbits |
| PCIe Hard IP | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Largest logic density in the Arria 10 family (vs. 10AX090R2F40E1SG)
- Highest I/O count in the F34 1152-ball package (vs. 10AX115N1F34E1SG)
- 17 Gbps transceiver capability at lower cost than speed grade 2 (vs. 10AX115H2F34E2SG)
Designhinweise
The 10AX115H1F34E1SG can dissipate 25-35W under typical workloads with full transceiver utilization. Per the Intel Arria 10 device datasheet, the F34 FCBGA has a junction-to-ambient thermal resistance of approximately 7-9 C/W with a properly designed thermal solution. Designers must implement a 6-8 layer PCB with internal copper planes (2 oz minimum), an external heat spreader or integrated heatsink, and adequate airflow (200-300 LFM). Early Power Estimator (EPE) should be run during the architecture phase to characterize worst-case power.
At 17 Gbps transceiver rates, signal integrity for the SERDES channels requires careful PCB design. Transceiver channels should use matched-length differential pairs with 100-ohm differential impedance, length matching within 5 mils, and continuous reference planes on adjacent layers. The F34 FCBGA break-out region typically requires 0.8 mm pitch microvia stack-ups and back-drilling for high-speed signals. Use Intel's Transceiver Toolkit and Quartus Prime IBIS-AMI models for channel simulation before tape-out.
The Arria 10 family uses SmartVID for dynamic core voltage scaling, requiring a controller-compliant voltage regulator. Core supply (VCC) operates at 0.85-0.9 V nominal, while transceiver supplies (VCCR/V CCT) and auxiliary supplies (VCCAUX, VCCPLL) require low-noise LDO regulation. Power-on sequence must follow the Arria 10 power management guidelines to avoid latch-up. The E1 speed grade reduces power consumption by approximately 10-15% versus the F1 grade at the same Fmax target.
A common pitfall when migrating between Arria 10 speed grades is the change in transceiver data rate capability - speed grade 1 supports 17 Gbps, while speed grades 2 and 3 are required for 24 Gbps. Designers must not assume higher speed grade functionality in a lower speed grade device. Additionally, the F34 package pinout is shared across all 10AX115 density variants (1,150K LEs), but the F40 and F45 packages have different ball assignments and require separate PCB layouts.
The F34 1152-ball FCBGA has a 1.0 mm ball pitch and 35x35 mm body size, requiring a high-density PCB stack-up. Designers should use an 8-10 layer stack-up with 4-6 routing layers, 0.4-0.5 mm trace width/spacing, and laser-drilled microvias. The 0.9 V core current of a fully populated 10AX115 can exceed 30 A, requiring a multi-rail power distribution network with plane-layer pairs directly above and below the device.
Compliance-Informationen
RoHS and lead-free compliance indicated by SG suffix in the ordering code. AEC-Q100 not applicable (FPGA, not automotive-grade discrete). Conflict minerals compliance per Intel's CMRT filing.
