10AX115N2F40I2SG vs 10AX115N4F40I3SG Vergleich
Detaillierter Direktvergleich von 10AX115N2F40I2SG von Intel und 10AX115N4F40I3SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N2F40I2SG | 10AX115N4F40I3SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.750,00 | $3.500,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Variable-precision, hard floating-point | [DATA_NEEDED: DSP block count] |
| Gehäuse | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-BBGA, FCBGA (F40), 40 x 40 mm, 1.00 mm pitch |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 2 | — |
| Process Technology | TSMC 20 nm | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Maximum User I/O | — | 600 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Process Node | — | 20 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCC core voltage] |
| Configuration | — | Serial, Parallel, and Avalon-ST supported |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Hardened IP | — | PCIe Gen3, 100G Ethernet MAC (per Quartus IP library) |
| Device Family Position | — | Mid-range 20 nm transceiver FPGA |