10AX115R2F40E2SG vs 10AX115R3F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX115R2F40E2SG von Intel und 10AX115R3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R2F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.410,00 | $4.925,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | 427,200 |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | 2,738 |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | — |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Speed Grade | -2 (E2, mid) | -2 |
| Betriebstemperatur | 0C to +100C (commercial) | — |
| Gehäuse | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS | Compliant | — |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| DSP Blocks | — | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Temperature Grade | — | E2 (0C to +100C) |
| Configuration Memory | — | Embedded (no external flash required for typical use) |
| RoHS-Status | — | Compliant |