10AX115R2F40E2SG vs 10AX115R3F40E2SG 对比
详细并排对比 10AX115R2F40E2SG 出自 Intel 和 10AX115R3F40E2SG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX115R2F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5,410.00 | $4,925.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | 427,200 |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | 2,738 |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | — |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Speed Grade | -2 (E2, mid) | -2 |
| 工作温度 | 0C to +100C (commercial) | — |
| 封装 | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA (F40), 1.0 mm pitch |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS | Compliant | — |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| DSP Blocks | — | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Temperature Grade | — | E2 (0C to +100C) |
| Configuration Memory | — | Embedded (no external flash required for typical use) |
| RoHS 状态 | — | Compliant |