10AX115R2F40E2SG vs 10AX115R3F40I2SG Vergleich
Detaillierter Direktvergleich von 10AX115R2F40E2SG von Intel und 10AX115R3F40I2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R2F40E2SG | 10AX115R3F40I2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.410,00 | $6.500,00 |
| Family | Arria 10 GX | 10AX115 |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | — |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | Yes (DDR4/DDR3) |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | Gen3 |
| Process Technology | 20 nm TSMC | — |
| Speed Grade | -2 (E2, mid) | I2 |
| Betriebstemperatur | 0C to +100C (commercial) | — |
| Gehäuse | 1517-ball FCBGA, 40 x 40 mm | 1517-BBGA, FCBGA (F40) |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| RoHS | Compliant | — |
| Series | — | Arria 10 GX |
| Logic Elements | — | 1,150,000 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O Count | — | 342 |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Transceiver Channels | — | 24 (up to 17.4 Gbps) |
| DSP Blocks | — | Yes (variable-precision) |
| Process Node | — | 20 nm (TSMC) |
| RoHS-Status | — | Compliant |
| MSL-Level | — | [DATA_NEEDED: MSL level] |