10AX115R3F40I2SG vs 10AX115R3F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX115R3F40I2SG von Intel und 10AX115R3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R3F40I2SG | 10AX115R3F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.500,00 | $4.925,00 |
| Series | Arria 10 GX | — |
| Family | 10AX115 | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (8,557 Kbit) |
| User I/O Count | 342 | — |
| Gehäuse | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Temperature Grade | Industrial (-40C to +100C) | E2 (0C to +100C) |
| Speed Grade | I2 | -2 |
| Transceiver Channels | 24 (up to 17.4 Gbps) | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | Yes (DDR4/DDR3) | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 | — |
| DSP Blocks | Yes (variable-precision) | 1,518 (variable-precision, hard FP) |
| Process Node | 20 nm (TSMC) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| Configuration Memory | — | Embedded (no external flash required for typical use) |