10AX115R3F40I2SG vs 10AX115R3F40E2SG Comparación
Comparación detallada lado a lado de 10AX115R3F40I2SG por Intel y 10AX115R3F40E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115R3F40I2SG | 10AX115R3F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.500,00 | $4.925,00 |
| Series | Arria 10 GX | — |
| Family | 10AX115 | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (8,557 Kbit) |
| User I/O Count | 342 | — |
| Encapsulado | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Temperature Grade | Industrial (-40C to +100C) | E2 (0C to +100C) |
| Speed Grade | I2 | -2 |
| Transceiver Channels | 24 (up to 17.4 Gbps) | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | Yes (DDR4/DDR3) | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 | — |
| DSP Blocks | Yes (variable-precision) | 1,518 (variable-precision, hard FP) |
| Process Node | 20 nm (TSMC) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| Configuration Memory | — | Embedded (no external flash required for typical use) |