10AX115U2F45E1SG vs 10AX115U2F45E2SG Vergleich
Detaillierter Direktvergleich von 10AX115U2F45E1SG von Intel und 10AX115U2F45E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115U2F45E1SG | 10AX115U2F45E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13.900,00 | $6.920,66 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 (variable-precision, hardened FP) |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceiver Channels | 24 | — |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | — |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| PCIe Hard IP | PCIe Gen3 x8 | Gen3 x8 |
| Process Node | TSMC 20 nm | 20 nm |
| Core Voltage | 0.9 V | — |
| Gehäuse | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA (45 mm) |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,560 |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (industrial) |
| Montageart | — | Surface Mount |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |