10AX115U2F45E1SG vs 10AX115U2F45E2SG Comparación
Comparación detallada lado a lado de 10AX115U2F45E1SG por Intel y 10AX115U2F45E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115U2F45E1SG | 10AX115U2F45E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13.900,00 | $6.920,66 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 (variable-precision, hardened FP) |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceiver Channels | 24 | — |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | — |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| PCIe Hard IP | PCIe Gen3 x8 | Gen3 x8 |
| Process Node | TSMC 20 nm | 20 nm |
| Core Voltage | 0.9 V | — |
| Encapsulado | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA (45 mm) |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,560 |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (industrial) |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |