10AX115U3F45E2LG vs 10AX115U2F45E2SG Vergleich
Detaillierter Direktvergleich von 10AX115U3F45E2LG von Intel und 10AX115U2F45E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115U3F45E2LG | 10AX115U2F45E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8.500,00 | $6.920,66 |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,560 |
| User I/O Count | 480 | — |
| Speed Grade | U3 (medium-performance, transceiver-focused) | 2 |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | — |
| Transceiver Data Rate | Up to 28.05 Gbps | — |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | 1,518 (variable-precision, hardened FP) |
| PCIe Hard IP | Gen3 x8/x16 | Gen3 x8 |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | DDR4, QDR-IV, RLDRAM3 |
| Betriebstemperatur | 0C to +100C (Industrial, E2 grade) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| Process Node | — | 20 nm |
| Temperature Grade | — | E2 (industrial) |
| Gehäuse | — | 1932-ball FCBGA (45 mm) |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |