10AX115U3F45E2LG vs 10AX115U2F45E2SG Comparison
Detailed side-by-side comparison of 10AX115U3F45E2LG by Intel and 10AX115U2F45E2SG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX115U3F45E2LG | 10AX115U2F45E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8,500.00 | $6,920.66 |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,560 |
| User I/O Count | 480 | — |
| Speed Grade | U3 (medium-performance, transceiver-focused) | 2 |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | — |
| Transceiver Data Rate | Up to 28.05 Gbps | — |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | 1,518 (variable-precision, hardened FP) |
| PCIe Hard IP | Gen3 x8/x16 | Gen3 x8 |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | DDR4, QDR-IV, RLDRAM3 |
| Operating Temperature | 0C to +100C (Industrial, E2 grade) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| Process Node | — | 20 nm |
| Temperature Grade | — | E2 (industrial) |
| Package | — | 1932-ball FCBGA (45 mm) |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |