10CL010YM164I7G vs 10CL010YM164C6G Vergleich
Detaillierter Direktvergleich von 10CL010YM164I7G von Intel und 10CL010YM164C6G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10CL010YM164I7G | 10CL010YM164C6G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,45 | $11,40 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kb) | — |
| Embedded 18 x 18 Multipliers | 23 | — |
| Maximum User I/O Pins | 101 | — |
| General-Purpose PLLs | 2 | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Betriebstemperaturbereich | -40 °C to 100 °C (Industrial) | — |
| Gehäuse | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA (M164), 8x8 mm, 0.5 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | JTAG, Active Serial (AS), Passive Serial (PS) |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS | — |
| Process Node | TSMC low-power process | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Memory Bits | — | 423,936 (414 Kbit) |
| Embedded Memory Blocks | — | M4K (4 Kbit) blocks |
| 18x18 Hardware Multipliers | — | 56 |
| PLLs | — | 4 (general-purpose) |
| Maximum User I/O | — | 101 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | TSMC 60 nm low-power |
| Operating Junction Temperature (Speed Grade 6) | — | 0C to +85C (commercial) |
| Speed Grade | — | 6 (commercial) |