10CL010YM164I7G vs 10CL010YM164C6G Comparación
Comparación detallada lado a lado de 10CL010YM164I7G por Intel y 10CL010YM164C6G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10CL010YM164I7G | 10CL010YM164C6G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,45 | $11,40 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kb) | — |
| Embedded 18 x 18 Multipliers | 23 | — |
| Maximum User I/O Pins | 101 | — |
| General-Purpose PLLs | 2 | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Rango de temperatura de funcionamiento | -40 °C to 100 °C (Industrial) | — |
| Encapsulado | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA (M164), 8x8 mm, 0.5 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | JTAG, Active Serial (AS), Passive Serial (PS) |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS | — |
| Process Node | TSMC low-power process | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Memory Bits | — | 423,936 (414 Kbit) |
| Embedded Memory Blocks | — | M4K (4 Kbit) blocks |
| 18x18 Hardware Multipliers | — | 56 |
| PLLs | — | 4 (general-purpose) |
| Maximum User I/O | — | 101 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | TSMC 60 nm low-power |
| Operating Junction Temperature (Speed Grade 6) | — | 0C to +85C (commercial) |
| Speed Grade | — | 6 (commercial) |