10CX150YF780I6G vs 10CX150YF780E6G Vergleich

Detaillierter Direktvergleich von 10CX150YF780I6G von Intel und 10CX150YF780E6G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10CX150YF780I6G 10CX150YF780E6G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $325,00 $575,00
Family Cyclone 10 GX Cyclone 10 GX
Logic Elements (LE) 150,000 150,000
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] 56,480
Embedded Memory (M20K blocks) [DATA_NEEDED: M20K block count] —
Embedded Memory (total bits) 10,907,648 bits —
DSP Blocks (18x19 multipliers) 484 —
Transceivers Up to 12 (3.125 Gbps) GX up to 12.5 Gbps
User I/O Pins [DATA_NEEDED: user I/O count for F780 package] 284
Gehäuse 780-ball FBGA (F780) 780-ball FCBGA
Process Node 20 nm —
Speed Grade I6G (industrial, -40C to +100C junction) -6 (E6G industrial fast)
Temperature Range Industrial: -40C to +100C (TJ) —
Hard Memory Controller DDR3 / DDR3L / LPDDR3 —
Hard PCIe PCIe Gen2 (x1/x2/x4 hard IP) —
Configuration Active Serial (AS), Passive Serial (PS), JTAG —
RoHS-Status Compliant (per distributor listing) Compliant
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL level]
Montageart Surface Mount (FBGA) Surface Mount (FCBGA)
Series — Cyclone 10 GX
Process Technology — 20 nm
Embedded Memory — 10,907,648 bits (approximately 10.9 Mbit)
Betriebstemperatur — -40C to +100C (Industrial)
PCIe Hard IP — PCI Express Gen2 x4 hard IP
DSP Blocks — Variable-precision, fixed/floating point
Memory Interfaces — DDR3, DDR4, LPDDR3, QDR II+
Lead-Free — Yes

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