10M02DCU324A7G vs 10M02DCU324I7G Vergleich
Detaillierter Direktvergleich von 10M02DCU324A7G von Intel und 10M02DCU324I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M02DCU324A7G | 10M02DCU324I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,30 | $1,55 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | 160 |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Betriebs-Sperrschichttemperatur | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Montageart | Surface Mount | — |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements (LEs) | — | 2,000 |
| Embedded Memory (M9K blocks) | — | 16 |
| Embedded Memory (bits) | — | 110,592 |
| Embedded Multipliers (18x18) | — | 16 |
| User I/O Banks | — | 8 |
| Gehäuse | — | 324-ball UBGA (U324) |
| Pin/Pitch | — | 324 balls / 0.8 mm pitch |
| Process Node | — | 55 nm |
| Configuration Memory | — | On-chip dual-boot flash |
| Core Voltage (VCCINT) | — | 1.2 V |
| Analog Block | — | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | — | -40C to +100C (I7 grade) |