10M02DCU324A7G - MAX 10 FPGA, 2K LE, 160 I/O, 324-UBGA | Intel
Teilenummer: 10M02DCU324A7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $10.68 | $10,68 |
| 10 | $9.85 | $98,50 |
| 100 | $8.72 | $872,00 |
| 500 | $7.45 | $3.725,00 |
| 1.000 | $6.3 | $6.300,00 |
10M02DCU324A7G Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells that can be rewired after manufacture to implement arbitrary digital circuits. FPGAs occupy a unique position between general-purpose microcontrollers (software-defined behavior, fixed hardware) and ASICs (fixed function, no post-silicon changes). The MAX 10 family extends this concept with on-die flash, integrated ADCs, and DSP blocks, making it suitable for glue logic, I/O expansion, motor control, and industrial interface bridging where deterministic hardware parallelism is required but ASIC NRE is unjustified.
Key features of the 10M02DCU324A7G include 2,000 logic elements (approximately 1.6K ALMs / 3,200 LUT4-equivalents), 110 Kbits of embedded SRAM, 16 embedded 18x18 multipliers, and a 1.5 Msps 12-bit successive-approximation ADC with up to 17 analog inputs. The device integrates a user flash memory block, internal oscillator, and PLL blocks. It is built on TSMC's 55 nm embedded flash process, allowing instant-on functionality from a single 3.3 V supply with no external configuration device.
Typical applications include industrial motor control, multi-protocol sensor interfacing, low-cost video processing for machine vision, LED display controllers, and bridge/glue logic in factory automation. The integrated 12-bit ADC and DSP blocks make it particularly suitable for closed-loop control loops in power conversion and motor drive stages.
When designing with the 10M02DCU324A7G, use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and timing closure; the free toolchain supports this device fully. Note that pinout and package thermal performance depend heavily on PCB stack-up - the 15x15 mm UBGA package requires microvia or laser-drilled via technology for reliable assembly on standard 4-layer FR-4 boards.
This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical Quartus Prime design notes not found in the bare datasheet.
Drop-in-Alternativen für 10M02DCU324A7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M02DCU324A7G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Integrated ADC, Speed Grade, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M02DCU324I7G
✅ Drop-In✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →10M02DCU324C8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M02DCU324A7G
✅ Drop-In✓ Auf Lager
$6.3 / Stück
Datenblatt ansehen →10M02SCU324A7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M02DCV36A7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M02DCU324A7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| Embedded Memory | 110,592 bits |
| User I/O Count | 160 |
| Embedded 18x18 Multipliers | 16 |
| User Flash Memory | Integrated (on-chip flash configuration) |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation |
| Core Voltage | 1.15 V to 1.25 V |
| Betriebs-Sperrschichttemperatur | -40 C to +125 C (TJ) |
| Package Type | 324-UBGA (Ultra FineLine BGA) |
| Package Dimensions | 15 x 15 mm |
| Montageart | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) |
| RoHS-Status | Compliant |
10M02DCU324A7G Pin-Konfiguration
| Pin A1 | IO — User I/O (multi-function; specific function per pin-out file) |
| Pin A2 | IO — User I/O |
| Pin A3 | GND — Ground reference |
| Pin A4 | VCCIO — I/O bank supply voltage |
| Pin A5 | IO — User I/O |
| Pin B1 | IO — User I/O |
| Pin B2 | VCCINT — Core logic supply (1.15-1.25 V) |
| Pin B3 | IO — User I/O |
| Pin B4 | IO — User I/O |
| Pin B5 | GND — Ground |
Typische Anwendungen
10M02DCU324A7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Multi-Protocol Sensor Interface Bridge, LED Display Video Wall Controllers, Low-Cost Machine Vision Pre-Processing, Power Conversion & Inverter Control, Automotive Body Electronics & I/O Expansion.
Industrial Motor Control
The 10M02DCU324A7G's 16 embedded 18x18 multipliers and integrated 12-bit ADC make it well suited for field-oriented control (FOC) loops on permanent-magnet and induction motor drives. The 2,000 logic elements can host the full FOC state machine, current-loop PI controllers, and SVM modulator in a single device, while the 160 I/O drive three-phase PWM outputs plus encoder / Hall-sensor inputs. Unlike a microcontroller approach, the FPGA gives deterministic single-cycle loop times below 1 us, which is critical for high-RPM precision servo applications.
Empfohlen
Multi-Protocol Sensor Interface Bridge
The 10M02DCU324A7G's 160 I/O and reconfigurable I/O standards let it bridge between heterogeneous industrial protocols - for example, I2C sensor arrays feeding SPI or UART host controllers, or MII/RGMII Ethernet to parallel sensor data. The 2,000 logic elements are sufficient to implement multi-master I2C controllers, SPI peripherals, and protocol-format converters in parallel. The on-chip user flash can store per-protocol bitstreams and bootloader code, enabling a single FPGA to support firmware-over-Ethernet field upgrades.
Empfohlen
LED Display Video Wall Controllers
For medium-resolution LED video walls, the 10M02DCU324A7G can drive up to 16 high-speed LVDS pairs simultaneously, supporting HUB75 LED panels at 1/16 scan rate up to 384x384 pixels per device. The integrated multipliers and dual-clock PLL handle gamma correction and color-space conversion. The non-volatile instant-on flash boot lets the panel start displaying test patterns within 50 ms of power-on - useful for safety signage that must show content immediately.
Empfohlen
Low-Cost Machine Vision Pre-Processing
The 10M02DCU324A7G can implement real-time Sobel / Laplacian edge detection on a parallel-pixel camera interface using its 16 multipliers and embedded SRAM as line buffers. The integrated 12-bit ADC supports direct connection to analog industrial cameras, while the 160 I/O drive a 24-bit RGB output bus plus overlay text layers. For higher-resolution applications, multiple 10M02 devices can be cascaded over LVDS, scaling to multi-megapixel inspections at low total cost.
Empfohlen
Power Conversion & Inverter Control
The 10M02DCU324A7G's deterministic logic and on-chip 12-bit ADC are well matched to digital-control loops in solar inverters, UPS systems, and telecom rectifiers. The 2,000 LE host the full digital controller (PI compensators, ramp generator, MPPT for solar), while 160 I/O support parallel MOSFET / IGBT gate-driver interfaces plus AC-line current sensing. The on-chip user flash stores calibration constants and protection thresholds - critical for non-volatile fault logging.
Empfohlen
Automotive Body Electronics & I/O Expansion
The 10M02DCU324A7G's -40 C to +125 C extended-industrial junction-temperature range and high I/O count support automotive body-control applications such as body-comfort modules, HVAC controllers, and BCM I/O expansion. With 160 I/O it can interface directly to LIN / CAN transceivers plus discrete switches / LEDs without external bus-expanders. Designers should note that this part is not AEC-Q100 qualified; for AEC-Q100 grade-1 / grade-2 applications, select the MAX 10 'A7G' automotive variants or the Cyclone 10 LP 'A7G' parts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M02DCU324A7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M02DCU324I7G | 10M02DCU324C8G | 10M02SCU324A7G | 10M02DCV36A7G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 324-UBGA (15x15 mm) | 324-UBGA (15x15 mm) - identical | 324-UBGA (15x15 mm) - identical | 324-UBGA (15x15 mm) - identical | 324-UBGA (15x15 mm) - identical |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| Embedded Memory (bits) | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| User I/O | 160 | 160 | 160 | 160 | 160 |
| Speed Grade | A7 (industrial, fast) | I7 (industrial, ~15% slower than A7) | C8 (commercial, ~20% slower than A7) | A7 | A7 |
| Operating Temperature | -40 C to +125 C (TJ) | -40 C to +100 C (industrial guaranteed) | 0 C to +85 C (commercial) | -40 C to +125 C (TJ) | -40 C to +125 C (TJ) |
Wichtigste Unterscheidungsmerkmale
- Non-volatile on-chip flash boot (vs. Cyclone 10 LP 10CL02 family)
- Integrated 12-bit SAR ADC (vs. Lattice iCE40 LP1K)
- 160 user I/O in BGA-324 footprint (vs. MAX 10 10M02 in M153 or U169 packages)
- A7 speed grade at -40 C to +125 C extended industrial (vs. 10M02DCU324C8G (C8 commercial grade))
Designhinweise
The 324-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W with a standard JEDEC 4-layer test board, but this degrades in dense PCB layouts with limited inner copper. For designs running at sustained high toggle rates above 50 MHz and high I/O utilization, use 8 thermal balls on the package bottom and connect them through to a ground plane with thermal vias (12-mil drill, 0.5 oz plating). Without this, junction-temperature derating may occur in sealed industrial enclosures at +70 C ambient.
The 15x15 mm 324-ball UBGA uses a 0.8 mm ball pitch - assembly requires PCB microvia or laser-drilled via technology (not standard 4-layer through-hole FR-4 alone). Use a 1-6-1 stack-up with HDI microvias from the top layer to internal ground planes for the BGA fanout. Allow at least 8 mm of perimeter trace space around the BGA for via fanout and reference-plane stitching capacitors; signal-integrity simulation is recommended for any DDR3 or LVDS pair routing through the BGA.
Do not confuse the 10M02DCU324A7G (MAX 10 family, non-volatile flash) with the Cyclone 10 LP 10CL02 parts (volatile SRAM, requires external configuration PROM). Both have similar LE counts but differ in boot behavior and toolchain IP libraries - Quartus Prime generates non-compatible bitstreams between the two families. Also note that the MAX 10 '10M02' is distinct from the MAX V '5M02' family; check the prefix '10M' vs '5M' before placing an order.
Place the 12-bit ADC analog power pins (VCCA) decoupled with 10 uF + 0.1 uF + 1 nF star topology - keep digital return currents out of the analog ground island. Use the Quartus Prime Pin Planner to assign differential I/O pairs (LVDS) before floorplanning, since the IOE structure of the MAX 10 imposes specific pair-placement rules for proper placement of the differential buffer and termination network.
Compliance-Informationen
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is the standard industrial-temperature variant; for AEC-Q100 automotive grades, refer to the 10M02 automotive ordering part numbers (separate OPN).
