10M04DAF256C7G vs 10M04DAU324C8G Vergleich
Detaillierter Direktvergleich von 10M04DAF256C7G von Intel und 10M04DAU324C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M04DAF256C7G | 10M04DAU324C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,45 | $0,00 |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | — |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | — |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Gehäuse | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 324-LFBGA |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | — |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 4,000 |
| Embedded Memory | — | 193,536 bits |
| User I/O | — | 246 |
| Package Code | — | U324 |
| Technology | — | 55 nm |
| Ordering Part Number | — | 10M04DAU324C8G |
| Speed Grade | — | C8G |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| I/O Standard Support | — | [DATA_NEEDED: I/O standard support] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Timing Performance | — | [DATA_NEEDED: timing performance] |
| Embedded Multiplier Count | — | [DATA_NEEDED: embedded multiplier count] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Maximum User I/O | — | 246 |
| Ball Grid Package | — | 324 balls |
| Device Manufacturer | — | Intel / Altera |