10M04DAF256C7G - MAX 10 FPGA 4K LE, 256-LBGA, -40C to 100C | Intel
Teilenummer: 10M04DAF256C7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $15.51 | $15,51 |
| 10 | $14.28 | $142,80 |
| 100 | $12.65 | $1.265,00 |
| 500 | $10.95 | $5.475,00 |
| 1.000 | $9.45 | $9.450,00 |
10M04DAF256C7G Übersicht
MAX 10 FPGAs are non-volatile, instant-on programmable logic devices that integrate a single-chip FPGA fabric with on-chip flash configuration memory, analog-to-digital converters (ADC), and optional dual-configuration flash. Positioned within the broader Intel FPGA portfolio, MAX 10 sits below Cyclone and Arria families, targeting glue-logic, I/O expansion, bridging, motor control, and small-form-factor embedded applications where instant-on boot, low power, and integrated peripherals reduce BOM cost.
Key features of the 10M04DAF256C7G include 4,000 logic elements (LEs), 176 Kbits of embedded SRAM (M9K blocks), 12 Kbits user flash memory partition, 178 maximum user I/Os, a single 12-bit 1 Msps SAR ADC, and an integrated PLL. The device also supports on-chip temperature sensing with four embedded thermal diodes, LVDS-capable transceivers up to 800 Mbps, and dual-boot configuration via the on-die flash. Power is supplied through a 1.2V core and 2.5V/3.3V auxiliary rails. The 256-LBGA package exposes 178 general-purpose user I/Os plus configuration, JTAG, and power pins.
The 10M04DAF256C7G is built on a low-power 55nm TSMC flash-based process. Its instant-on capability eliminates external boot memory and reduces bill-of-materials cost in space-constrained designs. The integrated analog front-end makes it suitable for sensor interfaces, while the embedded Nios II soft-core support enables MCU-class functionality inside the fabric. Compared to SRAM-based FPGAs such as Cyclone IV, MAX 10 reduces system complexity by combining configuration storage and logic on a single die.
Typical applications include industrial control and Human-Machine Interface (HMI) panels, IoT edge sensor aggregation, motor control for small BLDC and stepper drives, video bridging and I/O expansion in display modules, low-cost prototyping boards, and consumer devices requiring instant-on logic such as smart appliances and wearables.
When designing with this device, verify signal integrity for LVDS pairs and ensure adequate decoupling on the 1.2V core rail. Quartus Prime Lite or Quartus Prime Standard is required for synthesis; the device is supported by Intel Quartus software version 13.0 and later, with the latest tool versions providing the most stable place-and-route results for this 4K-LE part.
This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10M04DAF256C7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M04DAF256C7G (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements (LE), User Flash Memory, Process Technology, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M04DAF256A7G
✅ Drop-In✓ Auf Lager
$3.53 / Stück
Datenblatt ansehen →10M04DAF256I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04DAF256C8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04DAF256A8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04DAU256C7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04DAF256C7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 4,000 |
| Maximum User I/Os | 178 |
| Embedded Memory (M9K blocks total) | 176 Kbits |
| User Flash Memory | 193,536 bits |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) |
| Gehäuse | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm |
| Temperature Grade (junction) | 0C to 100C (commercial) |
| Core Voltage | 1.2 V |
| Auxiliary Voltage | 2.5 V / 3.3 V |
| ADC | 1 x 12-bit, 1 Msps SAR |
| PLL | 1 (general-purpose) |
| Process Technology | 55 nm TSMC flash-based |
| LVDS Transmitter (max data rate) | 800 Mbps |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
| Lead-Free | Yes |
10M04DAF256C7G 256-lbga (f256) fineline bga, 17 mm x 17 mm Pinbelegungsleitfaden
Pinbelegung für 10M04DAF256C7G (256-lbga (f256) fineline bga, 17 mm x 17 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M04DAF256C7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M04DAF256C7G ist geeignet für 6 Anwendungs: Industrial HMI and Control Panels, Motor Control and BLDC/PMSM Drive, IoT Edge Sensor Aggregation, Video Bridging and Display I/O Expansion, Low-Cost Prototyping and Education Boards, Consumer Smart Appliance Logic.
Industrial HMI and Control Panels
The 10M04DAF256C7G is well-suited for industrial Human-Machine Interface (HMI) panels where 4,000 logic elements provide ample capacity for display controllers, touch-panel debouncing, and protocol bridging. Its integrated 12-bit 1 Msps SAR ADC simplifies analog input acquisition from temperature sensors and rotary encoders, while 178 user I/Os support parallel RGB LCDs, capacitive touch interfaces, and isolated GPIO. Compared to discrete MCU+FPGA solutions, the 10M04DAF256C7G combines instant-on logic with on-die user flash, eliminating external boot memory and reducing BOM cost. The 256-LBGA package is appropriate for industrial-grade PCB layouts with controlled manufacturing. Designers should pair the FPGA with a dedicated LVDS transmitter for noise-immune display signaling, and use Quartus Prime Pin Planner to optimize I/O placement for the four I/O banks.
Empfohlen
Motor Control and BLDC/PMSM Drive
The 10M04DAF256C7G's 4,000 LEs and embedded M9K memory blocks support field-oriented control (FOC) loops, sinusoidal commutation, and encoder interfaces for small brushless DC and permanent-magnet synchronous motors. Its 12-bit 1 Msps ADC captures current-sense shunt feedback at PWM switching frequencies up to 100 kHz, while 178 user I/Os handle three-phase PWM, Hall sensors, and quadrature decoders. Compared to MCU-only motor controllers, the 10M04DAF256C7G provides deterministic parallel processing and custom waveform generation with sub-microsecond latency. For stepper motor drives, the FPGA fabric can implement micro-stepping controllers and stall-detection algorithms in hardware. The 256-LBGA package exposes sufficient I/Os for multi-axis drive integration.
Empfohlen
IoT Edge Sensor Aggregation
The 10M04DAF256C7G serves as an edge sensor aggregator in IoT gateways, processing multiple I2C, SPI, and UART sensor streams simultaneously thanks to its 4,000 logic elements and 178 user I/Os. The 193,536-bit user flash stores sensor calibration tables, lookup coefficients, and device identification, while the integrated ADC captures analog signals from environmental sensors. Compared to single-core MCUs, the FPGA fabric executes parallel sensor pipelines without RTOS overhead, achieving sub-millisecond latency for time-critical sensor fusion. The 256-LBGA package supports four I/O banks operating at different voltages (1.2V to 3.3V), enabling direct interface with mixed-voltage sensors without external level shifters. Quartus Prime provides seamless integration with embedded Nios II soft-core for higher-level protocol handling.
Empfohlen
Video Bridging and Display I/O Expansion
The 10M04DAF256C7G bridges between video sources and displays using its 800 Mbps LVDS transceivers and 178 user I/Os to support dual-channel LVDS, RGB parallel, and CSI-style interfaces. With 4,000 LEs, the FPGA implements color-space conversion, chroma resampling, and pixel-clock domain crossing without external memory. Compared to fixed-function bridge chips, the 10M04DAF256C7G is reprogrammable for multiple video formats including OpenLDI, RGB888, and LVDS-TTL conversion. The 256-LBGA package provides the I/O density needed for 24-bit color video buses plus control signals. For industrial display modules with custom timing requirements, the PLL generates pixel clocks up to 150 MHz.
Empfohlen
Low-Cost Prototyping and Education Boards
The 10M04DAF256C7G is widely adopted in FPGA development kits and university laboratory boards due to its 4,000-LE logic capacity, integrated ADC, and 256-LBGA package that exposes all peripherals for experimentation. Students and engineers can develop custom logic designs without external configuration memory, since the on-die flash supports instant-on boot. Compared to MAX V or Cyclone IV predecessors, the 10M04DAF256C7G adds integrated analog and flash storage in a single chip, reducing board complexity. The commercial C7 temperature grade supports typical lab environments. The device is fully supported by Intel Quartus Prime Lite, a free version of the FPGA toolchain that includes synthesis, place-and-route, and programmer tools.
Empfohlen
Consumer Smart Appliance Logic
The 10M04DAF256C7G integrates non-volatile logic into smart home appliances such as washing machines, induction cooktops, and HVAC controllers, where instant-on boot from on-die flash eliminates the cold-boot delay of MCU-based systems. With 4,000 LEs, designers can implement capacitive-touch sensing, multi-segment LED drivers, and motor control sequencing in a single chip. Compared to microcontroller-only designs, the FPGA fabric supports multiple parallel control loops for heating elements, pumps, and fans without RTOS scheduling complexity. The 256-LBGA package offers sufficient I/O density for keypad, display, and rotary encoder interfaces. Power consumption is typically below 50 mW static, suitable for always-on low-power designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M04DAF256C7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M04DAF256A7G | 10M04DAF256I7G | 10M04DAF256C8G | 10M04DAF256A8G | 10M04DAU256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (UBGA) - same pin count, different ball pitch |
| Logic Elements | 4,000 LE | 4,000 LE - same | 4,000 LE - same | 4,000 LE - same | 4,000 LE - same | 4,000 LE - same |
| User Flash Memory | 193,536 bits | 193,536 bits - same | 193,536 bits - same | 193,536 bits - same | 193,536 bits - same | 193,536 bits - same |
| Maximum User I/Os | 178 | 178 - same | 178 - same | 178 - same | 178 - same | 178 - same |
| Junction Temperature | 0C to 100C (C7 commercial) | -40C to 125C (A7 automotive, AEC-Q100) | -40C to 100C (I7 industrial) | -40C to 100C (C8 industrial) | -40C to 125C (A8 automotive) | 0C to 100C (C7 commercial) |
| ADC | 1 x 12-bit, 1 Msps | 1 x 12-bit, 1 Msps - same | 1 x 12-bit, 1 Msps - same | 1 x 12-bit, 1 Msps - same | 1 x 12-bit, 1 Msps - same | 1 x 12-bit, 1 Msps - same |
| AEC-Q100 Qualification | No (commercial C7) | Yes | No (industrial) | No (industrial) | Yes | No (commercial C7) |
Wichtigste Unterscheidungsmerkmale
- Integrated 12-bit 1 Msps SAR ADC eliminates external ADC chip (vs. 10M02SCU169A7G)
- On-die 193,536-bit user flash eliminates external boot memory (vs. 10CL016YU256I7G)
- Lowest-density MAX 10 with 178 user I/Os for maximum I/O density in F256 package (vs. 10M04DAF256A7G)
Designhinweise
The 10M04DAF256C7G requires three power rails: 1.2V for the core, 2.5V or 3.3V for the auxiliary and I/O banks, and an optional 1.2V to 3.3V supply for the analog ADC block. Decoupling requirements: at minimum one 100 uF bulk capacitor, ten 4.7 uF ceramic capacitors distributed across the board, and 100 nF high-frequency ceramics placed within 5 mm of every VCC pin. Power sequencing must bring up the 1.2V core before the 2.5V/3.3V rails to prevent latch-up; consult the MAX 10 Power Management User Guide for reference designs. Estimated static current at room temperature: approximately 30 mA on the 1.2V core.
The 256-LBGA F256 package has a 17 mm x 17 mm body with a 1.0 mm ball pitch, requiring 4-layer or higher PCB stack-up with microvia or via-in-pad technology for reliable BGA assembly. Match all BGA balls to internal power/ground planes via short 0.2 mm to 0.3 mm microvias. Maintain continuous ground planes beneath the FPGA to minimize return path impedance. The exposed thermal pad connects to ground and should be thermally bonded to the inner ground plane with multiple stitching vias. Signal integrity for 800 Mbps LVDS pairs requires controlled impedance of 100 ohm differential, with intra-pair skew less than 10 ps.
Do not assume that all 256 balls are user I/Os. The 10M04DAF256C7G exposes 178 user I/Os plus dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]), JTAG pins (TCK, TMS, TDI, TDO), clock pins, ADC analog inputs (ADCIN[7:0]), and power/ground balls. Using a wrong ball for I/O assignment will fail place-and-route in Quartus. Always verify the pinout against the MAX 10 Device Datasheet (M10-DS-02) before PCB layout. For dual-configuration boot, configure the MSEL pins correctly to select JTAG, AS, or dual-boot mode.
Compliance-Informationen
RoHS compliant per Intel MAX 10 product page. The C7 commercial grade is not AEC-Q100 qualified; choose the A7 variant for automotive.
