10M08DCF256I7G vs 10M16DCF256I7G Vergleich
Detaillierter Direktvergleich von 10M08DCF256I7G von Intel und 10M16DCF256I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DCF256I7G | 10M16DCF256I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,20 | $24,95 |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 16,000 |
| Embedded Memory (bits) | 387,072 | — |
| User I/O Count | 178 | 178 |
| DSP Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Gehäuse | 256-FBGA (FineLine BGA) | 256-ball FBGA (F256) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Supply Voltage - Core | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | — |
| On-die ADC | 12-bit, up to 1 MSa/s | — |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm NOR-flash-backed CMOS | 55 nm |
| Product Line | — | MAX 10 |
| Embedded Memory Bits | — | 562,176 bits |
| User Flash Memory | — | 256 Kbits |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (I7: -40C to +100C) |
| Embedded Multipliers (18x18) | — | 45 |
| PLL Count | — | 4 |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| On-chip ADC | — | 12-bit, 1 MSPS, up to 18 analog inputs |
| Hard Memory Controller | — | DDR3 SDRAM |
| Configuration Method | — | Internal flash, instant-on |