10M08DCF256I7G - MAX 10 FPGA, 8K LE, 256-FBGA | Intel
Teilenummer: 10M08DCF256I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $20.52 | $20,52 |
| 10 | $18.95 | $189,50 |
| 100 | $16.4 | $1.640,00 |
| 500 | $14.1 | $7.050,00 |
| 1.000 | $12.2 | $12.200,00 |
10M08DCF256I7G Übersicht
An FPGA (Field Programmable Gate Array) is a semiconductor device built from configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can reconfigure after manufacturing to implement custom digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the programmable-logic hierarchy, offering parallel processing, deterministic timing, and hardware-level flexibility that microcontrollers cannot match. The MAX 10 family targets low-power, cost-sensitive applications that still need the parallelism and I/O flexibility of programmable logic, such as industrial control, I/O expansion, and bridge/protocol conversion.
Key features of the 10M08DCF256I7G include an integrated ADC (up to 12-bit at 1 MSa/s), on-chip dual-configuration flash for field upgrades, support for LPDDR2/DDR3/DDR3L external memory interfaces, and an operating junction temperature range of -40C to +100C (industrial grade). The device also integrates a hard Nios II soft-core-capable controller fabric, embedded multipliers (24x18 DSP blocks), and up to 178 general-purpose I/O with LVDS support, making it suitable for glue-logic, sensor aggregation, and motor-control front-ends.
The MAX 10 architecture pairs a LUT-based logic fabric with distributed and block RAM (M9K blocks), dedicated 18x18 multipliers, and a hardened memory controller subsystem. The 256-FBGA package exposes all major I/O banks with 1.2V/2.5V/3.3V-compatible LVCMOS/LVDS interfaces, supporting dual-boot configuration from on-chip flash and partial reconfiguration in the field. Compared with SRAM-based FPGAs, MAX 10's flash-backed configuration eliminates external boot memory, reducing BOM cost and board area.
Typical applications include industrial machine vision pre-processing, multi-protocol bridge chips (UART-to-SPI, I2C-to-parallel), motor control and drive signal generation, low-cost video processing, factory sensor aggregation, and consumer appliance control. The integrated 12-bit ADC makes it especially attractive for analog sensor front-ends where a separate MCU ADC would be required.
When designing with the 10M08DCF256I7G, allocate sufficient decoupling (100nF + 10uF per power rail) and follow Intel's recommended PCB layout for the FBGA escape, paying particular attention to the VCCIO bank voltage grouping to avoid simultaneous-switching noise on sensitive analog inputs to the on-die ADC.
This page synthesizes distributor pricing, drop-in alternative MPNs, package-level comparison, and practical design notes that complement the official Intel MAX 10 datasheet and ordering guide.
Drop-in-Alternativen für 10M08DCF256I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08DCF256I7G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Process Technology, Operating Temperature, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M08DCF256C8G
✅ Drop-In✓ Auf Lager
$2.28 / Stück
Datenblatt ansehen →10M08DCF256A7G
✅ Drop-In✓ Auf Lager
$15.2 / Stück
Datenblatt ansehen →10M08DCF256I7P
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M08DCF256C7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M04DCF256A7G
✅ Drop-In✓ Auf Lager
$11.1 / Stück
Datenblatt ansehen →10M08DCF256I7G Grenzwerte & elektrische Eigenschaften
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (bits) | 387,072 |
| User I/O Count | 178 |
| Gehäuse | 256-FBGA (FineLine BGA) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) |
| On-die ADC | 12-bit, up to 1 MSa/s |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Process Technology | 55 nm NOR-flash-backed CMOS |
10M08DCF256I7G 256-fbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für 10M08DCF256I7G (256-fbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M08DCF256I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M08DCF256I7G ist geeignet für 7 Anwendungs: Industrial I/O Expansion and Glue Logic, Motor Control and Drive Signal Generation, Sensor Aggregation and Analog Front-End, Multi-Protocol Bridge Chip, Low-Cost Video and Image Pre-Processing, Consumer Appliance and Smart Home Control, LED Display and Lighting Controllers.
Industrial I/O Expansion and Glue Logic
The 10M08DCF256I7G is well suited to industrial I/O expansion where a microcontroller lacks sufficient pins or protocol flexibility. With 178 user I/O supporting LVCMOS/LVDS at 1.2V-3.3V and 8,000 logic elements, it can implement multi-protocol bridges (UART-to-SPI, I2C-to-Parallel, SPI-to-SPI) on a single chip. The on-die dual-configuration flash enables field firmware updates without external PROM, which is critical for installed-base products. Industrial PLCs, factory sensor hubs, and building-automation controllers commonly use MAX 10 in this exact role to offload real-time I/O servicing from a slower host MCU, with deterministic latency below 100 ns for interrupt-driven GPIO events.
Empfohlen
Motor Control and Drive Signal Generation
The 10M08DCF256I7G's combination of 8K LE, 18x18 multipliers, and 178 I/O makes it a strong fit for digital motor control, including field-oriented control (FOC) for BLDC and PMSM motors. The DSP blocks implement the Park/Clarke transforms and PI controllers at sub-microsecond latency, while the abundant I/O support PWM outputs, encoder feedback (QEI), and Hall-sensor inputs. The integrated 12-bit ADC samples phase currents at up to 1 MSa/s, eliminating an external ADC in cost-sensitive drives. Industrial servo drives, e-bike controllers, and small-format CNC spindles benefit from the deterministic hardware-loop execution and -40C to +100C industrial temperature range.
Empfohlen
Sensor Aggregation and Analog Front-End
The 10M08DCF256I7G integrates a 12-bit ADC capable of 1 MSa/s, allowing direct interface with analog sensors such as temperature, pressure, strain-gauge bridges, and 4-20 mA current loops. The 178 user I/O support SPI, I2C, and UART aggregation from dozens of digital sensors, while the embedded 387 Kbits of block RAM buffer multi-channel samples before forwarding to a host processor. Smart sensor hubs in factory automation, HVAC controllers, and environmental monitoring systems use MAX 10 to consolidate analog and digital sensing, reducing PCB area and BOM cost compared with separate MCU-plus-FPGA architectures.
Empfohlen
Multi-Protocol Bridge Chip
The 10M08DCF256I7G excels as a multi-protocol bridge, translating between industrial protocols such as Modbus RTU, CAN, SPI, I2C, RS-485, and Ethernet without host-processor intervention. Its non-volatile configuration ensures instant-on bridge availability at system power-up, and dual-configuration flash supports failsafe firmware rollback during field updates. Industrial gateways, protocol converters, and legacy-to-modern interface adapters rely on the MAX 10's I/O flexibility and on-chip flash to deliver reliable, deterministic protocol translation in temperatures from -40C to +100C.
Empfohlen
Low-Cost Video and Image Pre-Processing
The 10M08DCF256I7G supports parallel image-sensor interfaces through its LVDS-capable I/O, handling resolutions up to 720p at modest frame rates. The DSP blocks enable real-time filtering, thresholding, and histogram equalization on incoming pixel streams before forwarding to a host CPU. The 387 Kbits of block RAM buffer line-scan data for line-based processing pipelines. Industrial machine-vision front-ends, kiosk cameras, and entry-level surveillance recorders use the MAX 10 to offload pre-processing from a more expensive SoC, reducing system BOM while keeping deterministic processing latency.
Empfohlen
Consumer Appliance and Smart Home Control
The 10M08DCF256I7G's low unit cost at volume, on-chip flash, and integrated ADC suit consumer appliance controllers such as washing machines, refrigerators, induction cooktops, and smart thermostats. Its 8,000 logic elements handle user-interface glue logic, sensor readout, relay and TRIAC control, and capacitive-touch scanning simultaneously without an external MCU in simpler designs. The MAX 10's -40C to +100C industrial temperature range and instant-on behavior meet appliance reliability requirements, while field upgradability via dual-configuration flash enables post-sale firmware enhancements.
Empfohlen
LED Display and Lighting Controllers
The 10M08DCF256I7G drives high-channel-count LED matrices, DMX512-controlled architectural lighting, and addressable RGB strips through its 178 user I/O. The DSP blocks generate gamma-corrected PWM dimming curves and color-space conversion for accurate rendering. The non-volatile configuration ensures instant lighting behavior on power-up, important for emergency and architectural lighting. Commercial LED walls, stage lighting fixtures, and horticulture lighting benefit from the deterministic multi-channel PWM and 1 MSa/s ADC for ambient-light feedback.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M08DCF256I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M08DCF256C8G | 10M08DCF256A7G | 10M08DCF256C7G | 10M04DCF256A7G |
|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 |
| Embedded Memory (bits) | 387,072 | 387,072 | 387,072 | 387,072 | 189,440 |
| User I/O | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive | Commercial (0C to +85C) | Automotive |
| Speed Grade | 7 | 8 | 7 | 7 | 7 |
| On-die ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Configuration Flash | On-chip dual | On-chip dual | On-chip dual | On-chip dual | On-chip dual |
Wichtigste Unterscheidungsmerkmale
- On-die 12-bit ADC eliminates external ADC chip (vs. Lattice iCE40HX8K-CB256)
- Industrial temperature grade at the same die (vs. 10M08DCF256C8G (commercial grade))
- Larger logic capacity at same price tier (vs. 10M04DCF256A7G)
Designhinweise
The 256-FBGA package requires careful PCB escape routing; follow Intel's MAX 10 hardware design guide for via-in-pad or dogbone fan-out patterns. Use a 1.0 mm or 1.27 mm pitch BGA land pattern with NSMD (non-solder-mask-defined) pads to improve solder joint reliability. Place 100 nF X7R decoupling capacitors within 5 mm of every VCCIO and VCCINT pin, with bulk 10 uF tantalum or ceramic capacitors at each power-rail entry point.
Estimate: At typical MAX 10 10M08 core activity of 50% toggle rate and all I/O switching, total power consumption is approximately 0.5-1.0 W. The device requires separate VCCINT (core) and VCCIO (I/O bank) supplies, plus VCCA (analog for the on-die ADC). Add a ferrite bead or pi-filter between VCCINT and VCCIO to suppress switching-noise coupling into the analog rail. Sequence VCCIO before VCCA when the on-die ADC is enabled to avoid latch-up risk.
The 256-FBGA's theta-JA is approximately 15-20 C/W with a standard 4-layer JEDEC test board; at 1 W dissipation, junction temperature rise is 15-20C above ambient. For industrial-grade (-40C to +100C) operation, derate by keeping dissipation below 0.7 W to ensure margin at 100C ambient. Use thermal vias under the central BGA balls (often GND) to provide a thermal path to internal copper planes.
Do not leave configuration pins nCONFIG, nSTATUS, and CONF_DONE floating during power-up; pull them per Intel's reference design or use the MAX 10 internal pull-ups. The on-die ADC analog inputs are not 5V-tolerant; use an external resistor divider or op-amp buffer to bring 5V sensor signals within the VCCA range. When migrating bitstreams across temperature grades (I7 to C8 to A7), verify timing closure in Quartus Prime since speed grades differ slightly in internal timing margins.
Group I/O bank voltages by contiguous package balls; mixing 1.2V and 3.3V on adjacent banks increases simultaneous-switching noise. Route the on-die ADC analog inputs on an inner layer with a continuous ground reference, away from high-speed digital signals. The JTAG pins (TCK, TMS, TDI, TDO) should be pulled to known states via 4.7 kohm resistors, and the JTAG chain length kept below 50 mm to avoid signal-integrity issues at high TCK frequencies.
Compliance-Informationen
RoHS and lead-free compliance per Altera product page. The standard 10M08DCF256I7G is industrial-grade, not AEC-Q100 automotive-qualified; for AEC-Q100, consider the 10M08DAF256C7G or 10M08DCF256A7G variants.
