10M08SCE144C8G vs 10M08SAE144C8G Vergleich

Detaillierter Direktvergleich von 10M08SCE144C8G von Intel und 10M08SAE144C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M08SCE144C8G 10M08SAE144C8G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $15,95 $16,25
Family MAX 10 MAX 10
Logic Elements (LE) 8,000 8000
Total RAM 387,072 bits (M9K blocks) —
Embedded Multipliers 378 (18x18) —
PLLs 4 2 analog front-end PLLs
Global Clock Networks 20 —
User I/Os 101 —
Embedded User Flash 2 Mb —
ADC 12-bit, 1 Msps, up to 18 analog inputs —
Gehäuse 144-pin EQFP (LQFP with exposed pad), 22 x 22 mm, 0.5 mm pitch 144-LQFP Exposed Pad (EQFP)
Speed Grade S —
Temperature Grade C8 (Commercial: 0 °C to +85 °C) —
Supply Voltage (Core) 1.2 V typical —
Montageart Surface Mount Surface Mount (LQFP)
RoHS Compliance Compliant (per package marking EQFP-144 RoHS) —
Speichertyp Non-volatile (embedded flash, dual-configuration support) —
Configuration Method Internal flash, dual-image, single-supply instant-on —
Adaptive Logic Modules (ALM) — Not applicable (MAX 10 uses LE architecture, not ALM)
M9K Embedded Memory Blocks — 378 Kb total
MLAB Memory — [DATA_NEEDED: MLAB capacity]
Embedded 18x18 Multipliers — 24
User I/O Pins — 101
Process Technology — 55 nm flash-based CMOS
Configuration Memory — Internal flash, dual-image
Integrated ADC — 12-bit, 1 MSa/s, up to 17 analog inputs
Maximum User I/O Voltage — 3.3 V (LVCMOS/LVTTL); LVDS supported
External Memory Interface — DDR3, DDR2, LPDDR2
Betriebs-Sperrschichttemperatur — 0C to 85C (commercial)
RoHS-Status — Compliant
MSL-Level — [DATA_NEEDED: MSL rating]
Lead-Free — Yes
Halogenfrei — [DATA_NEEDED: halogen status]

Datenblätter & Ressourcen

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