10M08SCE144C8G vs 10M08SAE144C8G Comparaison
Comparaison détaillée côte à côte de 10M08SCE144C8G par Intel et 10M08SAE144C8G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
10M08SAE144C8G ✓ ActifComparaison des spécifications
| Paramètre | 10M08SCE144C8G | 10M08SAE144C8G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $15,95 | $16,25 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 8000 |
| Total RAM | 387,072 bits (M9K blocks) | — |
| Embedded Multipliers | 378 (18x18) | — |
| PLLs | 4 | 2 analog front-end PLLs |
| Global Clock Networks | 20 | — |
| User I/Os | 101 | — |
| Embedded User Flash | 2 Mb | — |
| ADC | 12-bit, 1 Msps, up to 18 analog inputs | — |
| Boîtier | 144-pin EQFP (LQFP with exposed pad), 22 x 22 mm, 0.5 mm pitch | 144-LQFP Exposed Pad (EQFP) |
| Speed Grade | S | — |
| Temperature Grade | C8 (Commercial: 0 °C to +85 °C) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Type de montage | Surface Mount | Surface Mount (LQFP) |
| RoHS Compliance | Compliant (per package marking EQFP-144 RoHS) | — |
| Type de mémoire | Non-volatile (embedded flash, dual-configuration support) | — |
| Configuration Method | Internal flash, dual-image, single-supply instant-on | — |
| Adaptive Logic Modules (ALM) | — | Not applicable (MAX 10 uses LE architecture, not ALM) |
| M9K Embedded Memory Blocks | — | 378 Kb total |
| MLAB Memory | — | [DATA_NEEDED: MLAB capacity] |
| Embedded 18x18 Multipliers | — | 24 |
| User I/O Pins | — | 101 |
| Process Technology | — | 55 nm flash-based CMOS |
| Configuration Memory | — | Internal flash, dual-image |
| Integrated ADC | — | 12-bit, 1 MSa/s, up to 17 analog inputs |
| Maximum User I/O Voltage | — | 3.3 V (LVCMOS/LVTTL); LVDS supported |
| External Memory Interface | — | DDR3, DDR2, LPDDR2 |
| Température de jonction en fonctionnement | — | 0C to 85C (commercial) |
| Statut RoHS | — | Compliant |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Sans halogène | — | [DATA_NEEDED: halogen status] |