10M16DAU324C8G vs 10M16DCU324A7G Vergleich
Detaillierter Direktvergleich von 10M16DAU324C8G von Intel und 10M16DCU324A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DAU324C8G | 10M16DCU324A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $35,40 | $34,95 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 16,000 | — |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | — |
| Gehäuse | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA (U324, 15x15 mm) |
| Core Supply Voltage | 1.2 V (on-chip regulator) | 1.2 V |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | 55 nm |
| Configuration Memory | Internal flash, dual-boot capable | Internal (dual-boot CFM) |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Betriebstemperatur | Commercial (0C to +85C) - speed grade 8 | -40 C to +125 C (automotive A7 grade) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Logic Elements (LEs) | — | 16,000 |
| User I/Os | — | 246 |
| Embedded User Flash | — | 562,176 bits |
| User Flash Memory | — | 16000 (per FindIC summary, kbit cells) |
| Maximum Internal Frequency | — | 472.5 MHz |
| Speed Grade | — | 7 (A7 automotive) |
| Qualification | — | AEC-Q100 (automotive grade) |
| 18x18 Multipliers | — | 45 (max) |