10M16DAU324C8G vs 10M16DCU324C8G Vergleich
Detaillierter Direktvergleich von 10M16DAU324C8G von Intel und 10M16DCU324C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DAU324C8G | 10M16DCU324C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $35,40 | $38,40 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 16,000 | 16,000 |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | 246 |
| Gehäuse | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA / 324-UBGA (U324) 15x15 mm |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | Internal flash (non-volatile) |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Betriebstemperatur | Commercial (0C to +85C) - speed grade 8 | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 (per JEDEC J-STD-020) | 3 |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Series | — | MAX 10 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| User Flash Memory | — | 562,176 bits |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 8 |
| Temperature Grade | — | Commercial (0C to +85C) |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |
| DSP Blocks | — | Yes (18x18 multipliers) |
| On-chip ADC | — | Yes (MAX 10 integrated) |
| Lead-Free | — | Yes |