10M16DAU324C8G vs 10M16DCU324C8G Comparison
Detailed side-by-side comparison of 10M16DAU324C8G by Intel and 10M16DCU324C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M16DAU324C8G | 10M16DCU324C8G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $35.40 | $38.40 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 16,000 | 16,000 |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | 246 |
| Package | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA / 324-UBGA (U324) 15x15 mm |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | Internal flash (non-volatile) |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Operating Temperature | Commercial (0C to +85C) - speed grade 8 | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) | 3 |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Series | — | MAX 10 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| User Flash Memory | — | 562,176 bits |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 8 |
| Temperature Grade | — | Commercial (0C to +85C) |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |
| DSP Blocks | — | Yes (18x18 multipliers) |
| On-chip ADC | — | Yes (MAX 10 integrated) |
| Lead-Free | — | Yes |