10M16SCU169A7G vs 10M04SCU169A7G Vergleich
Detaillierter Direktvergleich von 10M16SCU169A7G von Intel und 10M04SCU169A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16SCU169A7G | 10M04SCU169A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $30,15 | $10,85 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 16000 | — |
| Embedded Memory (Bits) | 562176 | — |
| User I/O Count | 130 | — |
| Total User I/O Pins | 130 | — |
| Gehäuse | 169-LFBGA (U169) | 169-UBGA (UFBGA-169, 11x11 mm, 0.5 mm pitch) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +125C (Automotive Grade) | — |
| Versorgungsspannung | 1.2 V core, 3.0 V / 3.3 V I/O | — |
| Configuration Memory | On-chip non-volatile flash | — |
| Embedded 18x18 Multipliers | 45 | — |
| Analog-to-Digital Converters | Dual 12-bit, 1 MSPS, 16 analog inputs | — |
| Automotive Qualification | AEC-Q100 | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm non-volatile | 55 nm embedded flash (TSMC) |
| Form Factor Terminal | BALL | — |
| Package Code | BGA (LFBGA-169) | — |
| Series | — | MAX 10 |
| Logic Elements | — | 4,000 |
| Embedded User Flash | — | 193,536 bits (189 Kb) |
| Embedded SRAM | — | 246 Kbits (M9K blocks) |
| Maximum User I/O | — | 130 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 3.3 V (LVCMOS tolerant) |
| Operating Temperature Grade | — | Automotive (A7G: -40C to +125C) |
| PLLs | — | 4 (one per side) |
| Global Clock Networks | — | 16 |
| Integrated ADC | — | 12-bit, up to 17 channels |
| Configuration Method | — | Internal flash (instant-on, dual image) |
| MSL-Level | — | 3 |
| Lead-Free / Halogen-Free | — | Yes / Yes |