10M16SCU169A7G - MAX 10 FPGA 16K LE 130 I/O | Intel | 169-LFBGA
Teilenummer: 10M16SCU169A7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $46.4663 | $46,47 |
| 10 | $41.82 | $418,20 |
| 100 | $37.2 | $3.720,00 |
| 500 | $33.48 | $16.740,00 |
| 1.000 | $30.15 | $30.150,00 |
10M16SCU169A7G Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic device hierarchy, above CPLDs, and are widely used as glue logic, co-processors, and accelerator fabrics alongside microcontrollers, ASICs, and ASSPs in embedded systems.
The key features of the 10M16SCU169A7G include 16K logic elements with embedded multiplier blocks and 9-bit memory logic array blocks (MLABs), 45 total embedded 18x18 multipliers, on-chip flash configuration (no external boot PROM required), dual ADCs for analog signal monitoring, and support for Nios II soft-core embedded processors. The automotive-grade AEC-Q100 qualification makes it suitable for harsh-environment designs.
Technically, the MAX 10 architecture combines a low-power 55 nm process with non-volatile flash, enabling instant-on operation at power-up. The integrated dual 12-bit ADCs sample up to 1 MSPS and support 16 analog inputs, eliminating the need for external monitoring ADCs in motor control and sensor fusion applications. The device targets 1.2 V core operation with 3.0 V or 3.3 V I/O banks.
Typical applications include industrial motor control, automotive body and chassis electronics, factory automation I/O expansion, video bridging and display controllers, and IoT edge nodes requiring instant-on logic. The integrated ADCs make it particularly well-suited to sensor aggregation designs.
When designing with the 10M16SCU169A7G, engineers should plan PCB layout for the LFBGA-169 footprint, including 1.0 mm pitch fan-out and matched-length routing for DDR/LVDS interfaces. Decoupling must follow Intel's recommended capacitor network, and JTAG signals require 4.7 kohm pull-ups for reliable configuration.
This page synthesizes distributor pricing, drop-in same-package alternatives within the MAX 10 family, and practical PCB design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10M16SCU169A7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M16SCU169A7G (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Integrated ADC, PLLs, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M16SAU169A7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M16SAU169I7G
✅ Drop-In✓ Auf Lager
$47.5563 / Stück
Datenblatt ansehen →10M16SAU169C8G
✅ Drop-In✓ Auf Lager
$21.4 / Stück
Datenblatt ansehen →10M16SCU169I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08SCU169A7G
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →10M04SCU169A7G
✅ Drop-In✓ Auf Lager
$10.85 / Stück
Datenblatt ansehen →10M16SCU169A7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 16000 |
| Embedded Memory (Bits) | 562176 |
| User I/O Count | 130 |
| Total User I/O Pins | 130 |
| Gehäuse | 169-LFBGA (U169) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (Automotive Grade) |
| Versorgungsspannung | 1.2 V core, 3.0 V / 3.3 V I/O |
| Configuration Memory | On-chip non-volatile flash |
| Embedded 18x18 Multipliers | 45 |
| Analog-to-Digital Converters | Dual 12-bit, 1 MSPS, 16 analog inputs |
| Automotive Qualification | AEC-Q100 |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Process Technology | 55 nm non-volatile |
| Form Factor Terminal | BALL |
| Package Code | BGA (LFBGA-169) |
10M16SCU169A7G bga (lfbga-169) Pinbelegungsleitfaden
Pinbelegung für 10M16SCU169A7G (bga (lfbga-169)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M16SCU169A7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M16SCU169A7G ist geeignet für 6 Anwendungs: Automotive Body Electronics, Industrial Motor Control, Video Bridging and Display Controllers, IoT Edge Sensor Aggregation, Factory Automation I/O Expansion, Test and Measurement Instrumentation.
Automotive Body Electronics
The 10M16SCU169A7G suits automotive body control modules (BCMs) where AEC-Q100 qualification and instant-on non-volatile boot are required. Its 16K logic elements and 130 GPIO support LIN/CAN gateway bridging, lighting control, mirror/wiper logic, and RKE decoding. The integrated dual 12-bit ADCs eliminate external sensors for battery voltage monitoring and temperature sensing, while 45 embedded 18x18 multipliers enable stepper motor drive for HVAC flaps. Compared to discrete microcontrollers, the FPGA's parallel logic replaces multiple MCUs and reduces PCB area. Design tip: place the LFBGA-169 on inner layers with matched-length routing for CAN-FD signals.
Empfohlen
Industrial Motor Control
The 10M16SCU169A7G drives 3-phase BLDC and stepper motor control loops in industrial servo drives, leveraging its 45 hardware multipliers for Park/Clarke transforms and SVPWM generation. The dual 12-bit 1 MSPS ADCs simultaneously sample phase currents and back-EMF, while 130 GPIO drives gate-driver ICs and encoder interfaces. Non-volatile flash boot eliminates boot-time delay critical for safety stops, and AEC-Q100 grade supports -40C to +125C operation in factory cabinets. Unlike a DSP+MCU partition, a single MAX 10 replaces both, cutting BOM cost by ~30%.
Empfohlen
Video Bridging and Display Controllers
The 10M16SCU169A7G implements protocol bridges between MIPI CSI-2, LVDS, RGB, and HDMI sources and sinks in industrial panel PCs and infotainment prototypes. With 562 kbit of embedded RAM, it buffers up to 4K line pairs of video data; 45 hardware multipliers accelerate color-space conversion (RGB-to-YUV) and scaling. The 169-LFBGA package enables compact PCB designs behind displays, and on-chip configuration flash enables field-upgradeable firmware. The integrated ADCs monitor backlight current and panel temperature for dynamic dimming algorithms.
Empfohlen
IoT Edge Sensor Aggregation
The 10M16SCU169A7G aggregates multiple low-speed sensor buses (I2C, SPI, UART, GPIO) into a single high-speed uplink in IIoT edge gateways, where its 16K LE handles 8+ concurrent protocol stacks and the dual ADCs sample analog sensor channels. Non-volatile flash boot ensures deterministic startup time for safety-critical edge nodes. The 169-LFBGA package integrates the FPGA plus ADCs on a sub-30x30 mm module, eliminating separate MCU+ADC+FPGA designs. Power consumption is typically under 200 mW at full GPIO toggle rate, suitable for solar-powered remote nodes.
Empfohlen
Factory Automation I/O Expansion
The 10M16SCU169A7G functions as a remote I/O expansion module in PLC backplanes, mapping 130 GPIO to EtherCAT, PROFINET, or Modbus TCP fieldbus protocols. Its non-volatile flash allows IP address and protocol parameters to persist through power cycles. 45 hardware multipliers accelerate protocol CRC checks and timing calculations. AEC-Q100 grade supports operation in -40C to +125C factory environments near motors and inverters, while the 169-LFBGA package fits on small DIN-rail modules.
Empfohlen
Test and Measurement Instrumentation
The 10M16SCU169A7G implements custom stimulus-response pattern generators and protocol analyzers in benchtop test equipment, where 16K LE provides sufficient capacity for state-machine sequencing and waveform synthesis. The dual 12-bit 1 MSPS ADCs digitize analog response signals, and on-chip flash stores calibration coefficients and test scripts. The 169-LFBGA package supports multi-channel parallel instrumentation designs, while AEC-Q100 grade tolerates temperature variations in lab environments. Design tip: use JTAG debug with SignalTap to reduce development iterations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M16SCU169A7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M16SAU169A7G | 10M16SAU169I7G | 10M16SAU169C8G | 10M16SCU169I7G | 10M08SCU169A7G | 10M04SCU169A7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-LFBGA (U169) | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same |
| Logic Elements | 16,000 LE | 16,000 LE - same | 16,000 LE - same | 16,000 LE - same | 16,000 LE - same | 8,000 LE (-50%) | 4,000 LE (-75%) |
| Embedded Memory | 562,176 bits | 562,176 bits - same | 562,176 bits - same | 562,176 bits - same | 562,176 bits - same | 378,880 bits (-33%) | 189,440 bits (-66%) |
| Temperature Grade | -40C to +125C (Automotive AEC-Q100) | -40C to +125C (Automotive) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| Configuration Memory | On-chip non-volatile flash | On-chip non-volatile flash - same | On-chip non-volatile flash - same | On-chip non-volatile flash - same | On-chip non-volatile flash - same | On-chip non-volatile flash - same | On-chip non-volatile flash - same |
| Embedded 18x18 Multipliers | 45 | 45 - same | 45 - same | 45 - same | 45 - same | 24 (-47%) | 16 (-64%) |
| Embedded ADCs | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS - same | Dual 12-bit, 1 MSPS - same | Dual 12-bit, 1 MSPS - same | Dual 12-bit, 1 MSPS - same | Dual 12-bit, 1 MSPS - same | Single 12-bit ADC |
| Automotive Qualification | AEC-Q100 qualified | AEC-Q100 qualified | Industrial only - not AEC-Q100 | Commercial only - not AEC-Q100 | Industrial only - not AEC-Q100 | AEC-Q100 qualified | AEC-Q100 qualified |
Wichtigste Unterscheidungsmerkmale
- Automotive AEC-Q100 qualification in the same 169-LFBGA package (vs. 10M16SAU169I7G)
- Highest logic-element density in the 169-LFBGA package tier (vs. 10M08SCU169A7G)
- On-chip non-volatile flash eliminates external boot memory (vs. Cyclone 10 LP equivalent)
Designhinweise
The 169-LFBGA package uses a 1.0 mm ball pitch. For reliable assembly, use microvia or via-in-pad technology with 4-6 layer stack-up, and route the outer rows of balls out on the top layer to reduce layer count. Follow Intel's MAX 10 hardware design guidelines for recommended decoupling: 0.1 uF X7R capacitors at every VCCIO/VCCINT ball pair plus bulk 10 uF tantalum near the regulator. Matched-length routing (within 50 mil) is required for LVDS pairs and DDR memory interfaces.
Do not confuse the temperature-grade suffix when ordering: 'A7G' = automotive -40C to +125C, 'I7G' = industrial -40C to +100C, 'C8G' = commercial 0C to +85C. The MAX 10 dual-configuration (10M16D) variants require additional flash programming steps for dual-boot support. Ensure JTAG signals (TCK, TMS, TDI, TDO) have 4.7 kohm pull-ups to VCCIO_3.3V for reliable configuration, and add a 10 kohm reset pull-up on nCONFIG/nSTATUS per the datasheet.
For high-speed LVDS and DDR interfaces on the 169-LFBGA, use 100-ohm differential routing with length matching within 5 mil. Place series termination resistors within 200 mil of the FPGA ball for LVDS. For the integrated 12-bit ADCs, route analog and digital grounds as a split plane joined at a single point near the ADC ground pin to minimize digital switching noise coupling into analog samples.
Compliance-Informationen
RoHS compliant and AEC-Q100 automotive qualified per the verified web data and Arrow Electronics listing. Lead-free. Halogen-free status not explicitly confirmed in the verified data.
