10M25DAF484A7P vs 10M25DAF484I7G Vergleich
Detaillierter Direktvergleich von 10M25DAF484A7P von Intel und 10M25DAF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484A7P | 10M25DAF484I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $54,75 | $99,80 |
| Series | MAX 10 | — |
| Logic Elements | 25,000 | — |
| Configurable Logic Blocks (CLBs) | 1,563 | — |
| Process Technology | 55 nm non-volatile | — |
| Embedded Memory | 1,728 Kbits | — |
| Maximum User I/O | 360 | — |
| Gehäuse | 484-ball Plastic BGA (S-PBGA-B484) | 484-FBGA (FBGA) |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Temperature Grade | Automotive (-40 C to +125 C TJ) | Industrial (-40 C to +100 C ambient) |
| Speed Grade | A7 | I7 |
| Configuration | Internal dual-boot flash (no external PROM) | — |
| On-chip ADC | 1 x 12-bit, 1 MSPS | — |
| PLLs | 2 (general-purpose) | 2 |
| DSP Blocks | Up to 25 (18x18 MAC) | — |
| Versorgungsspannung | 3.3 V or 1.8 V single supply | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Family | — | MAX 10 |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (bits) | — | 691,200 |
| User I/Os | — | 360 |
| Core Voltage | — | 1.2 V |
| Tray / Reel | — | Tray |
| 18 x 18 Multipliers | — | 66 |
| On-chip Configuration Flash | — | Dual (instant-on, dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |