10M25DAF484A7P vs 10M25DAF484I7G Comparación
Comparación detallada lado a lado de 10M25DAF484A7P por Intel y 10M25DAF484I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF484A7P | 10M25DAF484I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $54,75 | $99,80 |
| Series | MAX 10 | — |
| Logic Elements | 25,000 | — |
| Configurable Logic Blocks (CLBs) | 1,563 | — |
| Process Technology | 55 nm non-volatile | — |
| Embedded Memory | 1,728 Kbits | — |
| Maximum User I/O | 360 | — |
| Encapsulado | 484-ball Plastic BGA (S-PBGA-B484) | 484-FBGA (FBGA) |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Temperature Grade | Automotive (-40 C to +125 C TJ) | Industrial (-40 C to +100 C ambient) |
| Speed Grade | A7 | I7 |
| Configuration | Internal dual-boot flash (no external PROM) | — |
| On-chip ADC | 1 x 12-bit, 1 MSPS | — |
| PLLs | 2 (general-purpose) | 2 |
| DSP Blocks | Up to 25 (18x18 MAC) | — |
| Tensión de alimentación | 3.3 V or 1.8 V single supply | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (bits) | — | 691,200 |
| User I/Os | — | 360 |
| Core Voltage | — | 1.2 V |
| Tray / Reel | — | Tray |
| 18 x 18 Multipliers | — | 66 |
| On-chip Configuration Flash | — | Dual (instant-on, dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |