10M25DCF256A7G vs 10M50DCF256A7G Vergleich

Detaillierter Direktvergleich von 10M25DCF256A7G von Intel und 10M50DCF256A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M25DCF256A7G 10M50DCF256A7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $42,84 $29,80
Family MAX 10 MAX 10
Logic Elements (LE) 25,000 50,000
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
Embedded Memory (Kbits) 1,728 —
Embedded Memory (M9K Blocks) [DATA_NEEDED: M9K block count] —
Maximum User I/Os 178 —
DSP Blocks (18x18 Multipliers) 45 —
PLLs 4 —
Global Clock Networks [DATA_NEEDED: global clock count] —
Process Technology TSMC 55nm NOR Flash —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 3.3 V (supports 1.2/1.5/1.8/2.5/3.3 V) —
Configuration Internal dual-configuration flash (non-volatile) Internal flash (single-chip, instant-on)
Integrated ADC 12-bit, up to 1 Msps, 17 channels —
Gehäuse 256-ball FBGA (F256) 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch
Speed Grade -7 7 (DCF = dual-supply, commercial/industrial)
Temperature Grade Commercial (0C to +85C) —
Betriebstemperatur 0C to +85C -40 C to +85 C (industrial)
Maximum Core Frequency 450 MHz —
RoHS-Status Compliant Compliant
User Flash Memory — 1,677,312 bits
User I/O Count — 178
Process Node — 55 nm
Core Voltage — 1.2 V
I/O Bank Voltages — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Embedded Memory — M9K blocks, 9 Kbits each
Embedded Multipliers — 144 x 18 x 18
PLL — 4
On-chip ADC — 12-bit, 1 MSPS, 16 channels
Montageart — Surface Mount (BGA)
MSL-Level — 3 (168 hours)

Datenblätter & Ressourcen

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