10M50DAF256I7G vs 10M50DCF256A7G Vergleich
Detaillierter Direktvergleich von 10M50DAF256I7G von Intel und 10M50DCF256A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50DAF256I7G | 10M50DCF256A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,20 | $29,80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Gehäuse | 256-LBGA (17 mm x 17 mm) | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| PLLs | On-chip (4 typical for 10M50 family) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Betriebstemperatur | -40C to +100C (Industrial) | -40 C to +85 C (industrial) |
| Process Technology | TSMC 55 nm embedded flash | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | — |
| User Flash Memory | — | 1,677,312 bits |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Speed Grade | — | 7 (DCF = dual-supply, commercial/industrial) |
| Embedded Memory | — | M9K blocks, 9 Kbits each |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| MSL-Level | — | 3 (168 hours) |