10M50DAF256I7G vs 10M50DCF256A7G Comparison
Detailed side-by-side comparison of 10M50DAF256I7G by Intel and 10M50DCF256A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DAF256I7G | 10M50DCF256A7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $155.20 | $29.80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Package | 256-LBGA (17 mm x 17 mm) | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| PLLs | On-chip (4 typical for 10M50 family) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) | -40 C to +85 C (industrial) |
| Process Technology | TSMC 55 nm embedded flash | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| RoHS Status | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | — |
| User Flash Memory | — | 1,677,312 bits |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Speed Grade | — | 7 (DCF = dual-supply, commercial/industrial) |
| Embedded Memory | — | M9K blocks, 9 Kbits each |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| MSL Level | — | 3 (168 hours) |