10M50DAF484C7G vs 10M50DAF484I7G Vergleich

Detaillierter Direktvergleich von 10M50DAF484C7G von Intel und 10M50DAF484I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484C7G 10M50DAF484I7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $65,80 $58,20
Product Type FPGA (Field-Programmable Gate Array) —
Series MAX 10 —
Logic Elements 50,000 —
Embedded Memory 1,677,312 bits (approximately 1.6 Mbit) —
Embedded 18x18 Multipliers 312 —
User Flash Memory [DATA_NEEDED: user flash bits] —
Number of User I/O 360 —
Versorgungsspannung 1.2 V core (VCCINT) —
Gehäuse 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch 484-ball FBGA (F484)
Montageart Surface Mount Surface Mount (FBGA)
Configuration Memory Non-volatile embedded flash (dual-configuration) —
PLLs 2 4
Global Clock Networks [DATA_NEEDED: global clocks count] —
ADC Integrated 12-bit SAR, up to 17 channels —
Betriebstemperatur 0 C to +85 C (commercial grade, C7 speed) —
Process Technology 55 nm embedded flash CMOS TSMC 55 nm
MSL-Level 3 3 (per JEDEC J-STD-020)
RoHS-Status Compliant Compliant
Family — MAX 10
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Supply Voltage - Core — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
On-die Configuration Flash — Yes (dual-boot)
Integrated ADC — 12-bit, 1 MSPS, up to 18 channels
DSP Blocks — 144 (18x18 multipliers)
Configuration Mode — Single-chip (no external boot device required)
Lead-free / Halogen-free — Yes / Yes

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