10M50DAF484I7G vs 10M50DAF484C7G Vergleich

Detaillierter Direktvergleich von 10M50DAF484I7G von Intel und 10M50DAF484C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DAF484I7G 10M50DAF484C7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $58,20 $65,80
Family MAX 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded User Flash (bits) 1,677,312 (dual configuration) —
User I/O Count 360 —
Gehäuse 484-ball FBGA (F484) 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Package Pitch 1.0 mm —
Package Body Size 23 x 23 mm —
Process Technology TSMC 55 nm 55 nm embedded flash CMOS
Supply Voltage - Core 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
On-die Configuration Flash Yes (dual-boot) —
Integrated ADC 12-bit, 1 MSPS, up to 18 channels —
DSP Blocks 144 (18x18 multipliers) —
PLLs 4 2
Configuration Mode Single-chip (no external boot device required) —
Montageart Surface Mount (FBGA) Surface Mount
MSL-Level 3 (per JEDEC J-STD-020) 3
RoHS-Status Compliant Compliant
Lead-free / Halogen-free Yes / Yes —
Product Type — FPGA (Field-Programmable Gate Array)
Series — MAX 10
Logic Elements — 50,000
Embedded Memory — 1,677,312 bits (approximately 1.6 Mbit)
Embedded 18x18 Multipliers — 312
User Flash Memory — [DATA_NEEDED: user flash bits]
Number of User I/O — 360
Versorgungsspannung — 1.2 V core (VCCINT)
Configuration Memory — Non-volatile embedded flash (dual-configuration)
Global Clock Networks — [DATA_NEEDED: global clocks count]
ADC — Integrated 12-bit SAR, up to 17 channels
Betriebstemperatur — 0 C to +85 C (commercial grade, C7 speed)

Datenblätter & Ressourcen

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