10M50DCF672I7G vs 10M50DCF672C8G Vergleich

Detaillierter Direktvergleich von 10M50DCF672I7G von Intel und 10M50DCF672C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M50DCF672I7G 10M50DCF672C8G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $212,00 $51,75
Family MAX® 10 MAX 10 FPGA
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 1,677,312
Embedded Memory Blocks M9K 9-Kbit blocks —
DSP Blocks (18x18 Multipliers) 144 —
User I/Os 500 —
Gehäuse 672-ball FBGA (FineLine BGA), 1.0 mm pitch 672-BGA (FineLine BGA, FBGA-672)
Process Technology 55 nm —
Core Supply Voltage 1.2 V —
Configuration Memory On-chip dual-configuration flash —
User Flash Memory (UFM) [DATA_NEEDED: UFM size in Kbits] —
PLLs 4 general-purpose —
Global Clock Networks [DATA_NEEDED: global clock count] —
Integrated ADC 12-bit SAR, 1 MSPS, up to 17 analog input channels —
Temperature Sensor On-die diode —
On-chip Voltage Regulators Yes (internal core regulation) —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
Speed Grade 7 C8 (commercial, 8 speed bin)
RoHS-Status Compliant Compliant
Montageart Surface Mount (BGA) Surface Mount
MSL-Level 3 (per JEDEC J-STD-020) 3
Configuration Interface JTAG, Active Serial (AS), Passive Serial (PS) —
Series — MAX 10
User Flash Memory (bits) — 1,677,312
Maximum User I/O Pins — 500
Package Dimensions — 27 mm x 27 mm, 1.0 mm pitch
Betriebstemperatur — 0C to +85C (commercial)
Supply Voltage Core — [DATA_NEEDED: core voltage]
Configuration Method — On-chip non-volatile flash (instant-on)

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