10M50DCF672C8G - MAX 10 FPGA, 50K LE, 672-BGA | Intel
Teilenummer: 10M50DCF672C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $85.42 | $85,42 |
| 10 | $76.88 | $768,80 |
| 100 | $65.21 | $6.521,00 |
| 500 | $58.1 | $29.050,00 |
| 1.000 | $51.75 | $51.750,00 |
10M50DCF672C8G Übersicht
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs are a category of programmable logic devices sitting under the broader hierarchy of digital ICs -> logic ICs -> programmable logic. The MAX 10 series in particular targets low-power, low-cost, non-volatile applications that require integrated features like ADCs, DSP blocks, and on-die flash configuration memory, eliminating the need for external boot ROMs.
Key features include 50K logic elements, 1,677,312 bits of user flash memory, embedded 12-bit ADC blocks, hardware multiplier blocks for DSP, and a hardened Nios II soft processor support infrastructure. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards, with multi-voltage I/O banks allowing 1.2V to 3.3V interfacing on the same die. Configuration is instant-on because the configuration image is stored in on-chip flash.
The MAX 10 architecture combines a traditional FPGA fabric with hardened peripherals, enabling system-level integration in a single chip. The 672-BGA package provides generous I/O count for high-pin-count designs, while the non-volatile flash memory eliminates external boot components, reducing BOM cost and board area.
Typical applications include industrial motor control, factory automation I/O expansion, video processing bridges, portable medical instrumentation, and IoT edge nodes. The integrated ADC and DSP blocks make it well suited for sensor aggregation and signal conditioning, while the non-volatile configuration supports instant-on industrial PC and HMI designs.
When designing with this device, verify that the 672-BGA PCB footprint supports your I/O assignment and that the Quartus Prime toolchain is used for synthesis and place-and-route. Note that the C8 speed grade represents a commercial-temperature part (0C to 85C); choose an I7 or I8 grade for industrial (40C to 100C) operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10M50DCF672C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M50DCF672C8G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Speed Grade, Family, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M50DCF672C7G
✅ Drop-In✓ Auf Lager
$65.97 / Stück
Datenblatt ansehen →10M40DCF672C8G
✅ Drop-In✓ Auf Lager
$60.4 / Stück
Datenblatt ansehen →10M40DCF672C7G
✅ Drop-In✓ Auf Lager
$83.57 / Stück
Datenblatt ansehen →10M40DCF672I7G
✅ Drop-In✓ Auf Lager
$72.65 / Stück
Datenblatt ansehen →10M50DAF672C8G
✅ Drop-In✓ Auf Lager
$97.6 / Stück
Datenblatt ansehen →10M50DAF672C7G
✅ Drop-In✓ Auf Lager
$48.25 / Stück
Datenblatt ansehen →10M50DCF672C8G Grenzwerte & elektrische Eigenschaften
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| User Flash Memory (bits) | 1,677,312 |
| Maximum User I/O Pins | 500 |
| Gehäuse | 672-BGA (FineLine BGA, FBGA-672) |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch |
| Speed Grade | C8 (commercial, 8 speed bin) |
| Betriebstemperatur | 0C to +85C (commercial) |
| Montageart | Surface Mount |
| Configuration Method | On-chip non-volatile flash (instant-on) |
| RoHS-Status | Compliant |
| MSL-Level | 3 |
10M50DCF672C8G 27 mm x 27 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für 10M50DCF672C8G (27 mm x 27 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M50DCF672C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M50DCF672C8G ist geeignet für 6 Anwendungs: Industrial Motor Control, PLC I/O Expansion Modules, Video Processing Bridge, Portable Medical Instrumentation, IoT Edge Sensor Aggregation, Automotive Infotainment HMI Controller.
Industrial Motor Control
The 10M50DCF672C8G's 50,000 logic elements, integrated 12-bit ADC blocks, and DSP multipliers make it well suited for industrial motor control applications such as AC induction, BLDC, and stepper motor drives. The 500 user I/O pins enable direct interface to multiple encoder inputs, Hall sensors, and PWM outputs without external multiplexing. According to the Intel MAX 10 device overview, the on-chip flash enables instant-on configuration critical for safety motor-stop sequences. The non-volatile fabric eliminates boot ROM cost while the 672-BGA package supports the high pin count required for multi-axis drives.
Empfohlen
PLC I/O Expansion Modules
The 10M50DCF672C8G provides 500 user I/O pins and instant-on non-volatile configuration, ideal for industrial PLC I/O expansion modules that require deterministic startup and high pin count. The MAX 10 integrated ADC blocks handle analog input monitoring while the FPGA fabric implements IEC 61131-3 logic and fieldbus protocol bridges. Compared to discrete MCU solutions, the 10M50DCF672C8G delivers parallel I/O processing without CPU bottlenecks. The commercial temperature range suits standard factory environments; industrial temperature applications should select the I7 speed-grade variant for -40C to +100C operation.
Empfohlen
Video Processing Bridge
The 10M50DCF672C8G serves as a video format bridge converting between camera sensor interfaces, display panels, and embedded processors using its 50K logic elements and dedicated DSP blocks. The 672-BGA package exposes sufficient LVDS pairs for parallel camera interfaces and HDMI/DVI bridge implementations, while on-chip SRAM buffers video line data without external memory. The non-volatile configuration enables instant display startup, important for headless video processing appliances. Quartus Prime video IP cores and reference designs accelerate development of MIPI-to-LVDS or RGB-to-MIPI bridges.
Empfohlen
Portable Medical Instrumentation
The 10M50DCF672C8G is suited for portable medical devices such as patient monitors, diagnostic imaging interfaces, and handheld analyzers. Its integrated 12-bit ADC samples sensor inputs directly, while the DSP blocks implement digital filters for ECG, SpO2, and bioimpedance signal chains. The on-chip non-volatile flash enables instant-on boot critical for clinician-facing devices that must display within milliseconds of power-up. Designers should verify IEC 60601-1 compliance for the complete medical system; the MAX 10 itself supports functional safety design patterns but requires external isolation and EMI mitigation.
Empfohlen
IoT Edge Sensor Aggregation
The 10M50DCF672C8G aggregates multiple IoT sensor inputs including SPI, I2C, UART, and analog channels through its 500 user I/O pins and integrated ADC blocks. The 50K logic elements implement custom protocol stacks, edge analytics, and local decision-making without round-trip latency to the cloud. The non-volatile flash boots instantly on power restoration, important for unattended edge nodes. Quartus Prime supports soft-core processors like Nios II for running lightweight RTOS or edge inference workloads, and the device operates from standard 3.3V/1.2V rails common in IoT hardware.
Empfohlen
Automotive Infotainment HMI Controller
The 10M50DCF672C8G serves as a human-machine interface controller in automotive infotainment systems, driving displays, reading touch inputs, and bridging vehicle network buses such as CAN and LIN. The MAX 10 family includes AEC-Q100 qualified variants for automotive temperature grades (-40C to +125C), though the specific C8 commercial variant is better suited for cabin-mounted modules. The 50K logic elements handle multiple display pipelines and touch controller interfaces concurrently, while the 672-BGA package supports the multi-bus connectivity required by modern cockpit designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M50DCF672C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M50DCF672C7G | 10M40DCF672C8G | 10M40DCF672C7G | 10M40DCF672I7G | 10M50DAF672C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Logic Elements | 50,000 | 50,000 | 40,000 | 40,000 | 40,000 | 50,000 |
| Speed Grade | C8 (commercial) | C7 (commercial, faster) | C8 (commercial) | C7 (commercial, faster) | I7 (industrial -40C to +100C) | C8 (commercial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Non-Volatile Configuration | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) |
Wichtigste Unterscheidungsmerkmale
- Highest logic density in MAX 10 family with same package (vs. 10M40DCF672C8G)
- Faster speed grade option exists in same package (vs. 10M50DCF672C7G)
- Non-volatile configuration eliminates boot ROM (vs. 10M40DCF672I7G)
Designhinweise
The 672-BGA package with 1.0 mm pitch requires careful PCB layout to ensure reliable solder joints. Use a 4-6 layer stackup with dedicated power and ground planes directly beneath the BGA to provide low-inductance decoupling. All VCCINT and VCCA power pins must be decoupled with 100 nF ceramic capacitors placed within 2 mm of each pin pair, plus bulk 10 uF capacitors near the package. Use microvia-in-pad or dog-bone fanout techniques for BGA breakout, and follow Intel's MAX 10 hardware design guidelines for trace impedance control on high-speed LVDS pairs.
Estimated: At maximum ambient temperature of 85C with full logic utilization, the 10M50DCF672C8G may dissipate 1.5-2.5 W. The 672-BGA package thermal resistance theta_JA is approximately 15-20 C/W on a standard JEDEC 4-layer test board, resulting in a junction temperature rise of 25-50 C above ambient. For continuous full-load operation near maximum temperature, ensure adequate airflow or thermal via arrays beneath the package center to conduct heat to internal ground planes. Industrial temperature variants should be selected if the design operates above 85C ambient.
A common pitfall when designing with the 10M50DCF672C8G is leaving JTAG configuration pins floating, which can cause intermittent configuration failures. Tie TMS, TCK, and nCONFIG through 10 kohm pull-ups to VCCIO, and route nSTATUS back to the host processor for proper configuration handshaking. Also verify that all unused I/O pins are set to tri-state with weak pull-up enabled in the Quartus Prime assignments, otherwise they may draw excessive current or cause signal integrity issues on adjacent pins. Finally, ensure the configuration mode is correctly selected via MSEL pins at power-up.
Compliance-Informationen
RoHS compliant per Altera/Intel product documentation. C8 commercial temperature variant is not AEC-Q100 qualified; AEC-Q100 automotive variants are available in the MAX 10 family under separate order codes.
