5CSEBA6U23C8SN vs 5CSEBA6U23C7N Vergleich
Detaillierter Direktvergleich von 5CSEBA6U23C8SN von Intel und 5CSEBA6U23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 5CSEBA6U23C8SN | 5CSEBA6U23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.420,00 | $185,00 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | 800 MHz |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | Variable-precision DSP blocks |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | — |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | 28 nm low-power (TSMC) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | 0C to +85C (commercial) |
| Gehäuse | 672-ball UBGA (23x23 mm) | 672-UBGA (23x23 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | 3 |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Hard Processor System (HPS) | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | — | 1.1 V |
| FPGA Fabric | — | Cyclone V SE 5CSEA6 |
| Memory Interface | — | DDR3 hard controller with PHY |
| Transceivers | — | Per Cyclone V SE family architecture |