5CSEBA6U23C7N - Cyclone V SE SoC FPGA 110K LE Dual A9 672-UBGA | Intel
Teilenummer: 5CSEBA6U23C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $235 | $23.500,00 |
| 500 | $205 | $102.500,00 |
| 1.000 | $185 | $185.000,00 |
5CSEBA6U23C7N Übersicht
What is a SoC FPGA? A SoC FPGA is an integrated device that merges a microprocessor subsystem (typically ARM Cortex-A9 MPCore) with a programmable FPGA fabric on the same silicon die. This combination sits within the broader hierarchy of embedded computing: SoC -> System-on-Chip -> integrated circuit -> semiconductor. By co-locating the hard processor and the fabric, SoC FPGAs deliver lower system latency, reduced BOM count, smaller PCB area, and deterministic hardware acceleration that discrete processor-plus-FPGA two-chip solutions cannot match.
Key features of the 5CSEBA6U23C7N include the 110K logic element FPGA fabric, integrated DDR3 memory controller with hard PHY support, 3.125 Gbps transceivers on select variants, and a hard floating-point DSP block array for high-throughput signal processing. The HPS (Hard Processor System) includes dual ARM Cortex-A9 cores with NEON media engine, L1/L2 caches, ARM CoreSight JTAG debug, and standard peripherals such as USB 2.0, Gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers. The device is built on TSMC's 28 nm low-power process.
Typical applications include industrial machine vision and inspection, motor control and servo drives, factory automation PLCs, video surveillance and broadcast equipment, medical imaging, and small-cell wireless infrastructure. The combination of deterministic ARM processing with FPGA-based hardware acceleration makes the 5CSEBA6U23C7N especially attractive for latency-sensitive embedded designs that require both complex control software and parallel DSP pipelines.
When designing with this device, engineers should pay close attention to the multi-rail power sequencing requirements (1.1V core, 2.5V/3.3V I/O, PLL analog supply) and to the DDR3 interface pin assignments, which are tightly constrained by the U23 package variant. Quartus Prime design software with the SoC EDS toolkit is required for hardware/software co-development.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Cyclone V SE family, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop resource for evaluating the 5CSEBA6U23C7N.
Drop-in-Alternativen für 5CSEBA6U23C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA6U23C7N (gleiche Bauform und Footprint) – abweichend in Package, Embedded Memory, Logic Elements, Process Technology, DSP Blocks.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA6U23C6N
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →5CSEBA6U23C7SN
✅ Drop-In✓ Auf Lager
$410 / Stück
Datenblatt ansehen →5CSEBA6U23C8N
✅ Drop-In✓ Auf Lager
$132 / Stück
Datenblatt ansehen →5CSEBA5U23C7N
✅ Drop-In✓ Auf Lager
$103.88 / Stück
Datenblatt ansehen →5CSEBA4U23C7N
✅ Drop-In✓ Auf Lager
$124.5 / Stück
Datenblatt ansehen →5CSEBA6U23C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Process Technology | 28 nm low-power (TSMC) |
| Core Voltage | 1.1 V |
| Gehäuse | 672-UBGA (23x23 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0C to +85C (commercial) |
| FPGA Fabric | Cyclone V SE 5CSEA6 |
| Memory Interface | DDR3 hard controller with PHY |
| Transceivers | Per Cyclone V SE family architecture |
| DSP Blocks | Variable-precision DSP blocks |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
5CSEBA6U23C7N 672-ubga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSEBA6U23C7N (672-ubga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA6U23C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA6U23C7N ist geeignet für 7 Anwendungs: Industrial Machine Vision Systems, Motor Control and Servo Drives, Video Surveillance and Broadcast Equipment, Medical Imaging and Diagnostic Equipment, Factory Automation PLCs, Small-Cell Wireless Infrastructure, Test and Measurement Instrumentation.
Industrial Machine Vision Systems
The 5CSEBA6U23C7N is well suited for industrial machine vision platforms where a deterministic image-processing pipeline must run alongside a Linux control application. The dual ARM Cortex-A9 at 800 MHz handles camera protocol stacks (GigE Vision, USB3 Vision), HMI rendering, and PLC communication, while the 110K logic-element fabric absorbs Bayer-to-RGB conversion, lens shading correction, and feature extraction at line rate. The integrated DDR3 hard controller streams frame buffers without external memory glue logic. Engineers typically pair the FPGA fabric with HDMI or MIPI CSI-2 receive pipelines and use the HPS for OpenCV post-processing.
Empfohlen
Motor Control and Servo Drives
In industrial servo drives and variable-frequency motor controllers, the 5CSEBA6U23C7N's deterministic fabric delivers sub-microsecond current-loop PWM while the dual A9 cores run field-oriented control (FOC) state machines, EtherCAT or CANopen protocol stacks, and HMI logic. The 28 nm low-power process keeps junction temperature manageable inside sealed IP65 enclosures. Industrial designers benefit from the Cyclone V SE family's AEC-Q100-style qualification support and from the ability to hardware-accelerate the SVPWM, space-vector modulation, and encoder feedback decoding in fabric rather than spending MPU cycles on them.
Empfohlen
Video Surveillance and Broadcast Equipment
The 5CSEBA6U23C7N enables compact video broadcast appliances by combining H.264/H.265 encode/decode pipelines in fabric with a Linux-driven application processor for stream management and analytics. The 110K logic elements absorb HD-SDI or HDMI receive logic plus a multi-channel scaling engine, while the dual A9 subsystem handles RTSP, ONVIF, and metadata insertion. The DDR3 controller supplies the bandwidth required for uncompressed frame manipulation, and the U23 package's 23x23 mm footprint allows 1U rack-mount chassis designs without thermal concerns.
Empfohlen
Medical Imaging and Diagnostic Equipment
Ultrasound carts, portable patient monitors, and bedside diagnostic instruments benefit from the 5CSEBA6U23C7N's combination of deterministic hardware DSP and a Cortex-A9 application processor capable of running a medical-grade embedded OS. The Cyclone V SE fabric implements FIR/IIR filter chains, beamforming, and ECG/EEG front-end decimation, while the HPS runs the user interface, network stacks, and storage. Designers value the 28 nm low-power process for keeping the thermal envelope small enough for handheld enclosures, and the integrated DDR3 PHY reduces board area versus two-chip solutions.
Empfohlen
Factory Automation PLCs
The 5CSEBA6U23C7N is a strong fit for mid-range Programmable Logic Controllers (PLCs) that must execute IEC 61131-3 logic on the ARM cores while offloading high-speed counters, pulse-train outputs, and protocol conversion to the FPGA fabric. Engineers implement PROFIBUS, PROFINET, EtherCAT, or Modbus TCP state machines directly in fabric for sub-100 microsecond cycle times, while the HPS hosts the PLC runtime and web-based diagnostics. The U23 package supports the required GPIO density for 32-64 digital I/O points on a single module.
Empfohlen
Small-Cell Wireless Infrastructure
For small-cell base stations and wireless backhaul equipment, the 5CSEBA6U23C7N's logic density accommodates CPRI or OBSAI fronthaul interfaces, digital pre-distortion (DPD) blocks, and crest-factor reduction (CFR) pipelines in fabric, while the dual A9 cores run the L2/L3 stack and OAM software. The integrated DDR3 hard controller handles the buffering required between fronthaul and network-side data paths. Compared with discrete processor-plus-FPGA designs, the SoC FPGA form factor simplifies board layout and reduces both BOM cost and bill-of-materials risk in the radio unit.
Empfohlen
Test and Measurement Instrumentation
Bench-top oscilloscopes, logic analyzers, and protocol analyzers benefit from the 5CSEBA6U23C7N's parallel sample processing in fabric plus a full application processor on the same die. The FPGA fabric implements channel multiplexing, triggering, and signal-conditioning DSP, while the HPS runs the touchscreen UI, remote SCPI command interface, and LXI stack. The integrated DDR3 controller supplies the deep capture-memory bandwidth, and the 672-UBGA package allows designs that need 200+ GPIO for probe pods and auxiliary I/O without resorting to larger packages.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA6U23C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA6U23C6N | 5CSEBA6U23C7SN | 5CSEBA6U23C8N | 5CSEBA5U23C7N | 5CSEBA4U23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Family | Cyclone V SE SoC FPGA (5CSEA6) | Cyclone V SE SoC FPGA (5CSEA6) | Cyclone V SE SoC FPGA (5CSEA6) | Cyclone V SE SoC FPGA (5CSEA6) | Cyclone V SE SoC FPGA (5CSEA5) | Cyclone V SE SoC FPGA (5CSEA4) |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 | 49,000 |
| HPS | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz |
| Speed Grade | C7 | C6 (slower) | C7S | C8 (faster) | C7 | C7 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
Wichtigste Unterscheidungsmerkmale
- Higher fabric density within the same 672-UBGA U23 package family (vs. 5CSEBA4U23C7N)
- Standard commercial C7 speed grade with broad Quartus Prime timing-closure support (vs. 5CSEBA6U23C8N)
- Full SoC integration (HPS + FPGA) versus FPGA-only Cyclone V GX/GT (vs. 5CGXBC7C7F23C8N)
Designhinweise
The 5CSEBA6U23C7N requires at least four independent supply rails - 1.1V core (VCC, VCCP), 2.5V/3.3V FPGA I/O and PLL analog, and 1.5V/1.35V DDR3 supply. Power sequencing is critical: the 2.5V PLL analog supply must ramp before or with the 1.1V core to avoid latch-up. Designers commonly use the TPS65218 multi-rail PMIC together with discrete LDOs for the PLL and HPS analog rails. Bulk decoupling of at least 220 uF per rail plus 0.1 uF + 10 nF ceramics placed within 5 mm of each BGA power-ball cluster is recommended.
Estimated: in a typical industrial machine-vision design with 60-70% fabric utilization and the HPS running at 600 MHz, total device power is roughly 4-6 W. With the 672-UBGA U23 package's published theta-JA of about 12-14 C/W on a 4-layer JEDEC board, junction temperature rises approximately 50-85 C above ambient. To keep Tj below 100 C in a sealed 70 C enclosure, plan for thermal vias under the BGA center thermal balls plus a moderate copper spreader on the top-side inner layers. Forced airflow is recommended if the HPS runs heavy vision workloads continuously.
The 672-UBGA U23 package uses 1.0 mm ball pitch. Use laser-drilled microvias (0.1 mm) with staggered or stacked via structure for signal fan-out, and full thermal via arrays (0.3 mm drill, 0.5 mm pitch) directly under the package thermal balls. The DDR3 interface must be routed with matched-length fly-by topology and 100 ohm differential impedance for the DQS pair; reference Intel's Cyclone V External Memory Interface Guidelines for trace-length tolerances and layer stack-up recommendations.
Two common mistakes: (1) ignoring the HPS boot configuration pins (BOOTSEL[2:0], BSEL[2:0]) which select NAND, SD/MMC, QSPI, or FPGA-assisted boot sources - mis-wiring these prevents the ARM cores from booting. (2) Using the 1.8V HPS I/O bank without the proper reference voltage on the HPS_VREF pin. Always cross-check the Cyclone V pin information for the U23 package variant because I/O bank assignments differ between U19 and U23 packages.
Compliance-Informationen
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable for commercial-grade Cyclone V SE device - choose I7 industrial-grade variant for harsher environments.