5CSEBA6U23I7LN vs 5CSEBA6U23I7NTS Vergleich

Detaillierter Direktvergleich von 5CSEBA6U23I7LN von Intel und 5CSEBA6U23I7NTS von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 5CSEBA6U23I7LN 5CSEBA6U23I7NTS
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $184,83 $213,52
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 110,000 110,000
Processor Cores Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum CPU Clock 925 MHz —
Gehäuse 672-pin UBGA (UBG-672) 23x23 mm 672-pin UBGA (23x23 mm)
Montageart Surface Mount (BGA) Surface Mount
Speed Grade I7 (fast) —
Temperature Range Industrial (-40C to +100C junction) —
Suffix L Lead-free —
Suffix N Tray packaging —
RoHS-Status Compliant (lead-free suffix) Compliant
Hard Memory Blocks [DATA_NEEDED: total M10K and MLAB bits] —
DSP Blocks [DATA_NEEDED: variable-precision DSP block count] —
HPS Peripherals Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO —
Configuration Mode JTAG and Active Serial (AS) —
Process Node TSMC 28 nm low-power —
Design Toolchain Intel Quartus Prime + SoC EDS —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency — 925 MHz
Process Technology — 28 nm low-power
Embedded Memory (Bits) — 4,450,000 (4.45 Mbits)
DSP Blocks (18x18 Multipliers) — 224
Core Voltage — 1.1 V
Operating Temperature Grade — Industrial -40C to 100C
Packaging Format — Tray (NTS suffix)
DDR Memory Interface — DDR2/DDR3/LPDDR2 up to 3.125 Gbps
PCIe Hard IP — PCIe Gen2 x4

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