A3P1000-1FGG256M vs A3P1000-2FG256M Vergleich
Detaillierter Direktvergleich von A3P1000-1FGG256M von Microchip Technology und A3P1000-2FG256M von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip
A3P1000-1FGG256M ✓ AktivMicrochip Technology
A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FG256M ✓ AktivSpezifikationsvergleich
| Parameter | A3P1000-1FGG256M | A3P1000-2FG256M |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,00 | $45,10 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 1000000 | — |
| Logic Elements | 11000 LE | 11000 LE |
| User I/O | 177 | — |
| Embedded RAM | 147456 bits | — |
| I/O Banks | 4 | 4 banks (banked VCCIB) |
| Core Supply Voltage | 1.5 V | — |
| Betriebsversorgungsspannung | 1.5 V | 1.5 V |
| Speed Grade | -1 | 2 |
| Configuration Memory | Flash (nonvolatile, single chip) | — |
| Programmability | In-system reprogrammable | Reprogrammable, non-volatile flash |
| Betriebstemperatur | 0C to +85C | — |
| Gehäuse | 256-LBGA (FBGA-256) | — |
| Montagestil | SMD/SMT | SMD/SMT |
| Packaging | Tray | Tray |
| Product Series | A3P1000 | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Number of Gates | 1000000 | — |
| Number of I/Os | — | 177 I/O |
| System Frequency | — | 310 MHz |
| Technology | — | 130 nm CMOS, flash-based |
| Gehäuse / Bauform | — | FBGA-256 (256-LBGA) |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +85 C |
| Configuration | — | Single-chip, instant-on (no external config PROM) |
| Series | — | A3P1000 |