A3P1000-1FGG256M vs A3P1000-2FG256M 对比

详细并排对比 A3P1000-1FGG256M 出自 Microchip Technology 和 A3P1000-2FG256M 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3P1000-1FGG256M A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip

A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip

A3P1000-1FGG256M ✓ 量产中
Microchip Technology
A3P1000-2FG256M A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

A3P1000-2FG256M ✓ 量产中

规格对比

参数 A3P1000-1FGG256M A3P1000-2FG256M
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1.00 $45.10
Family ProASIC3 ProASIC3
System Gates 1000000 —
Logic Elements 11000 LE 11000 LE
User I/O 177 —
Embedded RAM 147456 bits —
I/O Banks 4 4 banks (banked VCCIB)
Core Supply Voltage 1.5 V —
工作电源电压 1.5 V 1.5 V
Speed Grade -1 2
Configuration Memory Flash (nonvolatile, single chip) —
Programmability In-system reprogrammable Reprogrammable, non-volatile flash
工作温度 0C to +85C —
封装 256-LBGA (FBGA-256) —
安装方式 SMD/SMT SMD/SMT
Packaging Tray Tray
Product Series A3P1000 —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Number of Gates 1000000 —
Number of I/Os — 177 I/O
System Frequency — 310 MHz
Technology — 130 nm CMOS, flash-based
封装 / 外壳 — FBGA-256 (256-LBGA)
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +85 C
Configuration — Single-chip, instant-on (no external config PROM)
Series — A3P1000

数据手册与资源

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