A3P1000L-1FGG256 vs A3P1000L-1FG256 Vergleich
Detaillierter Direktvergleich von A3P1000L-1FGG256 von Microchip Technology und A3P1000L-1FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P1000L-1FGG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
A3P1000L-1FGG256 ✓ AktivMicrochip Technology
A3P1000L-1FG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
A3P1000L-1FG256 ✓ AktivSpezifikationsvergleich
| Parameter | A3P1000L-1FGG256 | A3P1000L-1FG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,33 | $38,90 |
| Family | ProASIC3L | ProASIC3L (Flash FPGA) |
| Logic Elements / LEs | 11K LEs | — |
| System Gates | 1M gates (approx.) | 1,000,000 |
| Number of I/O | 177 | — |
| Embedded Memory | 147456 bit | — |
| Core Voltage | 1.2 V (low-power L variant) | — |
| Technology | 130 nm flash process | Nonvolatile flash, CMOS |
| Configuration Memory | Nonvolatile flash, single-chip, Instant-On | On-chip flash (single-chip, Instant-On) |
| Speed Grade | -1 | -1 |
| Gehäuse | 256-LBGA (FBGA-256) | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Reprogrammability | Yes, in-system reprogrammable flash fabric | — |
| Security | Flash-based, secure nonvolatile bitstream storage | — |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | Compliant |
| MSL-Level | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Logic Elements (VersaTiles) | — | 24,576 |
| User I/Os | — | 177 |
| Embedded SRAM | — | 147,456 bits |
| Core Voltage (L grade) | — | 1.2 V (1.2 V to 1.5 V supported) |
| Maximale Taktfrequenz | — | [DATA_NEEDED: verified fMAX for -1 grade] |
| Low Power Feature | — | Flash*Freeze technology |
| Package Height | — | 1.6 mm |