A3P1000L-1FG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
Teilenummer: A3P1000L-1FG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $55.33 | $55,33 |
| 10 | $51.2 | $512,00 |
| 100 | $46.8 | $4.680,00 |
| 500 | $42.5 | $21.250,00 |
| 1.000 | $38.9 | $38.900,00 |
A3P1000L-1FG256 Übersicht
A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration ROM. Unlike SRAM FPGAs, flash FPGAs are single-chip, Instant-On devices that start operating within microseconds of power-up, require no external boot device, and are inherently more secure because the bitstream never leaves the package. Within the programmable logic hierarchy, the A3P1000L sits at the mid-density tier of the ProASIC3L family, positioned above the A3P600L and below the A3P3000L.
Key features include a 1.2 V low-power core voltage (the L suffix), support for 1.2 V to 1.5 V core operation per the Microchip product page, and the family-exclusive Flash*Freeze technology, which lets the device enter an ultra-low-power static mode while retaining state and waking instantly. Nonvolatile flash programming removes configuration PROM cost and simplifies board design.
The ProASIC3L architecture is built on a sea-of-tiles flash fabric with VersaTile logic elements configurable as LUT3, D-type flip-flop, or memory, supported by dedicated blocks: embedded SRAM (147,456 bits as listed by DigiKey), math-oriented hardware support, and abundant clock resources. Maximum internal clock performance reaches the 250-350 MHz class (FindIC lists 350 MHz; Microchip USA lists 250 MHz for the Y variant), sufficient for glue logic, control, and data-path functions in embedded systems.
Typical applications include portable and battery-powered instrumentation, industrial control and automation, secure single-chip system controllers, space-constrained embedded interfaces, and low-power glue logic consolidation in defense and medical electronics where Instant-On operation matters.
When designing with the A3P1000L, budget core voltage carefully: the L grade targets 1.2 V core operation for lowest dynamic power, and I/O banks must be supplied per bank to match external interface standards.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P1000L-1FG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P1000L-1FG256 (gleiche Bauform und Footprint) – abweichend in Package, Technology, System Gates, Family, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P1000L-1FGG256
✅ Drop-In✓ Auf Lager
$55.33 / Stück
Datenblatt ansehen →A3P1000L-1FG256Y
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P1000-1FG256T
✅ Drop-In✓ Auf Lager
$89.64 / Stück
Datenblatt ansehen →A3P1000-1FGG256T
✅ Drop-In✓ Auf Lager
$112.06 / Stück
Datenblatt ansehen →A3P1000-FGG256M
✅ Drop-In✓ Auf Lager
$27.85 / Stück
Datenblatt ansehen →A3P1000-FG256M
✅ Drop-In✓ Auf Lager
$50.87 / Stück
Datenblatt ansehen →A3P1000L-1FG256 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 1,000,000 |
| Logic Elements (VersaTiles) | 24,576 |
| User I/Os | 177 |
| Embedded SRAM | 147,456 bits |
| Core Voltage (L grade) | 1.2 V (1.2 V to 1.5 V supported) |
| Speed Grade | -1 |
| Technology | Nonvolatile flash, CMOS |
| Configuration Memory | On-chip flash (single-chip, Instant-On) |
| Low Power Feature | Flash*Freeze technology |
| Gehäuse | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch |
| Package Height | 1.6 mm |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
A3P1000L-1FG256 1.6 mm Pinbelegungsleitfaden
Pinbelegung für A3P1000L-1FG256 (1.6 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P1000L-1FG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P1000L-1FG256 ist geeignet für 6 Anwendungs: Battery-Powered Portable Instrumentation, Industrial Control and Automation, Secure Single-Chip System Control, Glue Logic Consolidation, Medical and Diagnostic Equipment, Aerospace and Defense Embedded Logic.
Battery-Powered Portable Instrumentation
The A3P1000L-1FG256 fits portable instruments because its 1.2 V L-grade core cuts dynamic power and Flash*Freeze technology collapses the device into an ultra-low static state while retaining every register and SRAM bit. In a handheld data logger, the FPGA handles sensor front-end glue logic, timing generation, and display interfaces, then enters Flash*Freeze between measurement cycles and wakes in a single clock cycle. The single-chip flash configuration also removes the external boot ROM, saving board area and its associated leakage. With 24,576 logic elements and 177 user I/Os, one device typically consolidates the functions of several discrete ICs, further reducing the total battery-load budget in compact enclosures.
Empfohlen
Industrial Control and Automation
In industrial control panels, the A3P1000L-1FG256 implements deterministic state machines, encoder interfaces, safety interlock logic, and communication bridges with Instant-On behavior that matters at machine power-up: the flash fabric is functional within microseconds, so I/O are controlled before a soft MCU finishes booting. The 1,000,000-gate capacity and 24,576 VersaTiles absorb protocol translation between legacy field signals and modern serial links, while 177 I/Os interface PLC backplanes directly. Because configuration is stored in on-chip flash, vibration-prone factory environments avoid socketed configuration devices. The FG256 17 x 17 mm FBGA also withstands industrial temperature profiles when the appropriate grade suffix is selected.
Empfohlen
Secure Single-Chip System Control
Flash-based FPGAs are preferred where the bitstream must never leave the chip: the A3P1000L-1FG256 stores its configuration in on-chip nonvolatile flash, eliminating the configuration-readout attacks that SRAM FPGAs are exposed to at boot. In secure controllers for access systems, defense electronics, and licensed equipment, this single-chip property plus the secure ProASIC3 programming chain protects proprietary logic. The device implements cryptographic helpers, tamper-response logic, and board-level sequencing in the 24,576-element fabric while the Flash*Freeze mode preserves keys held in registers during idle. Instant-On operation also enforces security policy from the first microsecond of power application.
Empfohlen
Glue Logic Consolidation
Many boards accumulate aging PLD, FIFO, bus-bridge, and address-decoder devices that become sourcing liabilities. The A3P1000L-1FG256 replaces such clusters with one flash FPGA: 24,576 VersaTiles comfortably absorb multiple 22V10-class CPLDs plus buffers, and 147,456 bits of embedded SRAM implement FIFOs that once needed dedicated parts. Instant-On flash configuration preserves the power-up behavior of the original PLDs, which matters for reset trees and enable sequencing. Consolidation reduces BOM lines, board area, and qualification effort; with 177 user I/Os in a 1.0 mm-pitch FBGA, dense legacy buses map directly without fanout adapters.
Empfohlen
Medical and Diagnostic Equipment
Medical monitors and diagnostic devices benefit from the A3P1000L-1FG256's combination of deterministic Instant-On I/O control and low standby power. The FPGA manages sensor timing, filter logic, and alarm chains with fixed latency, while Flash*Freeze holds patient-session state during idle periods between measurements. The single-chip flash configuration supports equipment integrity requirements because no external bitstream can be substituted. With 1,000,000 gates, the device also implements the processing glue between analog front ends and a host processor in portable ultrasound, ECG, and lab instruments, where the 17 x 17 mm FBGA keeps the electronics compact.
Empfohlen
Aerospace and Defense Embedded Logic
Microsemi (now Microchip) flash FPGAs have a long heritage in defense and aerospace subsystems, and the A3P1000L-1FG256 continues that role for rad-tolerant-adjacent, high-reliability board designs that need reprogrammability without configuration PROMs. Instant-On operation satisfies stringent power-up sequencing requirements in avionics; the flash fabric resists configuration disturbance, and Flash*Freeze supports duty-cycled payloads on constrained power budgets. The 1M-gate fabric implements bus interfaces, telemetry formatting, and safe-state controllers, while single-chip configuration reduces connector count and failure modes. Designers typically pair it with rugged power and supervisor components from the same reliability-qualified ecosystem.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P1000L-1FG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P1000L-1FGG256 | A3P1000-1FG256T | A3P1000-FGG256M |
|---|---|---|---|---|
| Package | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FGG256), 17 x 17 mm - same footprint | 256-ball FBGA (FG256) - same footprint | 256-ball FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 24,576 VersaTiles | 24,576 | 24,576 | 24,576 |
| User I/Os | 177 | 177 | 177 | 177 |
| Core Voltage | 1.2 V (L grade) | 1.2 V (L grade) | 1.5 V (standard) | 1.5 V (standard) |
| Flash*Freeze Technology | Yes | Yes | No (standard ProASIC3) | No (standard ProASIC3) |
| Embedded SRAM | 147,456 bits | 147,456 bits | 147,456 bits | 147,456 bits |
| Configuration | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On |
Wichtigste Unterscheidungsmerkmale
- Low-power 1.2 V core with Flash*Freeze (vs. A3P1000-1FG256T)
- Same-die same-package FGG variant for sourcing flexibility (vs. A3P1000L-1FGG256)
- Single-chip flash configuration (vs. SRAM FPGAs of similar density (Xilinx/Artix class))
Designhinweise
Supply the core at 1.2 V for the L-grade low-power operating point; the family supports 1.2 V to 1.5 V core per the Microchip product page, but timing closure in Libero SoC is valid only for the voltage you analyzed. Provide separate I/O bank supplies matched to the interface standards of each bank, and decouple every VCC ball with a local capacitor plus bulk capacitance at the board level. Follow the datasheet power-up ramp and sequencing requirements so the flash fabric initializes cleanly and I/O are tristated during ramp.
Estimated: with a 1.2 V core and mostly static logic, dynamic power in the 24,576-tile fabric is typically modest, but verify with Libero SmartPower using your actual toggle rates. The 256-ball FBGA dissipates heat mainly through the board, so provide solid ground/via farms under the package. For designs held in Flash*Freeze for most of the duty cycle, thermal design is rarely limiting; continuous high-toggle designs at elevated ambient deserve a junction-temperature calculation before layout freeze.
Do not assume the FG256 and FGG256 ball maps are interchangeable without checking the datasheet package table - the two 256-ball variants differ in ball assignment despite the same 17 mm body. Also remember that designs closed on the non-L A3P1000 at 1.5 V are not timing-valid on the A3P1000L at 1.2 V without re-running place-and-route. Finally, use the Flash*Freeze pin correctly: I/O must be in a defined state when entering the mode to guarantee state retention per the ProASIC3L datasheet.
Compliance-Informationen
Distributor listings present the part as RoHS-compliant lead-free. Formal REACH/halogen declarations must be pulled from the official Microchip product page.
