A3P600-1FGG484I vs A3P600-FG484 Vergleich
Detaillierter Direktvergleich von A3P600-1FGG484I von Microchip Technology und A3P600-FG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-1FGG484I - 600K Gate Flash FPGA 235 I/O | Microchip
A3P600-1FGG484I ✓ AktivMicrochip Technology
A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
A3P600-FG484 ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-1FGG484I | A3P600-FG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $79,60 | $56,30 |
| Family | ProASIC3 | ProASIC3 (Flash FPGAs) |
| System Gates | 600000 | — |
| VersaTiles (D-flip-flops) | 13824 | — |
| User I/Os | 235 | — |
| Gehäuse | 484-ball FBGA (FGG484) | 484-pin FBGA, 23x23 mm |
| Speed Grade | -1 | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm flash process | — |
| Logic Architecture | VersaTile (LUT / D-flip-flop / latch) | — |
| Configuration Memory | On-chip flash (nonvolatile, single chip) | On-chip flash (non-volatile, instant-on) |
| System Performance | Up to approx. 231 MHz (per Utmel family comparison) | 231 MHz |
| I/O Banks | 4 (A3P600 per Microchip migration note) | — |
| Betriebstemperatur | Industrial (-40C to +100C), I suffix | 0C to +85C (TJ) |
| Montageart | Surface Mount | Surface Mount |
| Reprogrammability | Live reprogrammable (in-system) | — |
| Number of Dedicated RAM Blocks | [DATA_NEEDED: embedded memory blocks] | — |
| Max User Flash Memory | [DATA_NEEDED: embedded flash capacity] | — |
| DLL/PLL Resources | [DATA_NEEDED: clock conditioning resources] | — |
| Total Gates | — | 600000 gates |
| Number of Registers | — | 13824 |
| VersaTiles (Logic Elements) | — | 13824 |
| Maximum User I/O | — | 235 I/O |
| Process Technology | — | 130 nm, 7-layer metal flash |
| Core Supply Voltage | — | 1.425 V to 1.575 V |
| Embedded Memory | — | Embedded block SRAM (18 kbit blocks) |
| Soft Processor Support | — | ARM Cortex-M1 (optional soft core) |
| RoHS-Status | — | RoHS3 Compliant (lead-free per FGG variant) |
| Packaging | — | Tray |
| Programming | — | In-system programmable via JTAG, no external boot device |